Optical inspection system TR7700L SIII Plus

cameraautomatedsoldering

Introduction
TR7700L SIII Plus is the latest generation of TRI's AOI solutions for PCB inspection, providing high-precision multi-phase inspection at production speed. The system pairs an ultra-fast color camera, an intelligent auto conveyor and an updated GUI to enable fast programming, optimized board handling and integration with production lines including offline programming support. TRI's color algorithm with multi-phase lighting increases defect coverage while minimizing false calls.

Features

• High-precision full-speed multi-phase AOI
• Updated GUI for fast programming and offline editing
• Intelligent auto conveyor to reduce board load/unload times
• Advanced color algorithm with RGB+W phases for improved accuracy

Optical System
Imaging method: Dynamic Imaging
Top camera: 4 or 12 Mpix high-speed color camera
Imaging resolution: 5.5 µm or 10 µm (factory setting). Note: 4 MP configuration supports 10 µm; 12 MP supports 5.5 µm.
Lighting: Multi-phase RGB+W LED
3D technology: Single or dual 3D laser sensors (optional)
Max. 3D range: @5.5 µm: 2 mm
@10 µm: 4 mm
Note: Range depends on board size, layout and laser configuration

Inspection Performance
Imaging speed: @5.5 µm 2D = 24 cm²/s
@10 µm 2D = 60 cm²/s
@5.5 µm 2D+3D (optional): 4–10 cm²/s
@10 µm 2D+3D (optional): 27–39 cm²/s
Note: Throughput depends on board size, layout and optional 3D configuration

Motion Table & Control
X-axis control: Ballscrew + AC-servo controller
Y-axis control: Ballscrew + AC-servo controller
Z-axis control: N/A
X-Y axis resolution: 1 µm

Board Handling
Max PCB size: 765 x 610 mm
PCB thickness: 0.6–5 mm
Max PCB weight: standard 3 kg (options: 5 / 12 kg)
Top clearance: 25 mm
Bottom clearance: 40 mm
Edge clearance: 3 mm (4 / 5 mm optional)
Conveyor: Inline height 880–920 mm; SMEMA compatible

Inspection Functions

• Component checks: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material
• Solder checks: Excess solder, Insufficient solder, Bridging, Through‑hole pins, Lifted lead, Golden finger, Scratch/Contamination

Dimensions
WxDxH: 1365 x 1720 x 1710 mm (excluding signal tower; signal tower height 520 mm)
Weight: 1005 kg

Technical specifications

• Model: TR7700L SIII Plus
• Imaging method: Dynamic Imaging
• Top camera: 4 or 12 Mpix high-speed color camera
• Imaging resolution: 5.5 µm or 10 µm (factory setting)
• Lighting: Multi-phase RGB+W LED
• 3D: Single/dual 3D laser sensors (optional); max 3D range @5.5 µm: 2 mm; @10 µm: 4 mm
• Imaging speed: @5.5 µm 2D = 24 cm²/s; @10 µm 2D = 60 cm²/s; 2D+3D optional ranges depend on configuration
• Motion: Ballscrew + AC-servo (X/Y); X-Y resolution 1 µm
• Max PCB size: 765 x 610 mm
• PCB thickness: 0.6–5 mm
• Max PCB weight: standard 3 kg (options 5 / 12 kg)
• Clearances: Top 25 mm; Bottom 40 mm; Edge 3 mm (4 / 5 mm optional)
• Conveyor height: Inline 880–920 mm; SMEMA compatible
• Inspection capabilities: comprehensive component and solder defect detection including OCV wrong marking, tombstoning, bridging, excess/insufficient solder, lifted leads, foreign material
• Dimensions (machine): 1365 x 1720 x 1710 mm (excluding signal tower)
• Weight (machine): 1005 kg