Optical inspection system TR7700QE

video visioncamera3D

Introduction
The TR7700QE AOI delivers high-performance 3D solder and assembly inspection for production and R&D environments. It combines next-generation 2D and 3D imaging with 4‑way adaptive digital fringe projection and CAD‑based programming to accelerate setup and enhance repeatable defect detection.

Features

• Advanced 2D + 3D coverage for solder and component inspection
• Four-way digital fringe projectors for accurate 3D profiling
• 3D height range up to 40 mm (Z-axis required)
• High-speed CoaXPress imaging option for increased throughput
• Optional 3D laser module for complementary height measurement

Optical System

• Imaging method: Stop-and-Go Imaging
• Top camera: 12 Mpix
• Angle camera: N/A
• Imaging resolution: 10 µm, 15 µm (factory setting)
• Lighting: Multi-phase true color LED; coaxial lighting
• 3D technology: Quad digital fringe projectors
• Max. 3D range: 0–40 mm (default 0–20 mm; requires Z-axis control)

Inspection Performance

• Imaging speed examples: 12 Mpix @10 µm: 13.5 cm²/s; with CoaXPress: 23 cm²/s
• 12 Mpix @15 µm: 30 cm²/s; with CoaXPress: up to 50 cm²/s (dependent on component distribution)

Motion Table & Control

• X-axis: Ballscrew + AC-servo controller (linear motor optional)
• Y-axis: Dual-driven ballscrew + AC-servo controller
• Z-axis: Ballscrew + AC-servo controller (optional)
• X-Y axis resolution: 1 µm

Board Handling

• Max PCB size: TR7700QE: 510 x 460 mm; TR7700L QE: 660 x 610 mm; TR7700QE DL: 510 x 310 mm x2 lanes or 510 x 590 mm x1 lane
• PCB thickness: 0.6–5 mm
• Max PCB weight: 3 kg
• Clearances: Top 50 mm; Bottom 40 mm; Edge 3 mm (5 mm optional)
• Conveyor: Inline; height 880–920 mm; SMEMA compatible

Inspection Functions

• Component checks: missing, tombstoning, billboarding, polarity, rotation, shift, wrong marking (OCV), defective, upside down, extra component, foreign material, lifted component
• Solder checks: fillet height, solder volume %, excess solder, insufficient solder, bridging, through‑hole pins, lifted lead, golden finger, scratch/contamination

Dimensions

• WxDxH: TR7700QE: 1100 x 1730 x 1750 mm; TR7700L QE: 1250 x 1880 x 1750 mm; TR7700QE DL: 1100 x 1830 x 1750 mm (signal tower not included; tower height 520 mm)
• Weight: TR7700QE: 920 kg; TR7700L QE: 1170 kg; TR7700QE DL: 950 kg

Technical specifications

• Product name: TR7700QE
• Imaging method: Stop-and-Go Imaging
• Top camera resolution: 12 Mpix
• Imaging resolution options: 10 µm, 15 µm (factory setting)
• 3D technology: Quad digital fringe projectors
• Max. 3D height range: 0–40 mm (default 0–20 mm; requires Z-axis)
• Lighting: Multi-phase true color LED, coaxial lighting
• Imaging speed examples: 13.5 cm²/s (12 Mpix @10 µm) up to 50 cm²/s (12 Mpix @15 µm with CoaXPress)
• X/Y motion: Ballscrew + AC-servo (dual-driven Y); linear motor optional
• X-Y axis resolution: 1 µm
• Max PCB size (standard): 510 x 460 mm
• PCB thickness supported: 0.6–5 mm
• Max PCB weight: 3 kg
• Clearances: Top 50 mm; Bottom 40 mm; Edge 3 mm (5 mm optional)
• Conveyor: Inline; height 880–920 mm; SMEMA compatible