Optical inspection system TR7500 SIII Ultra

laserCMOSvideo vision

Introduction
The TR7500 SIII Ultra integrates multi-camera side-view inspection, optional AI-powered defect detection algorithms, and metrology-grade measurements for high‑precision PCB inspection. Designed for SMT production lines, the system improves detection of inner‑layer bridges and hidden defects while supporting Industry 4.0 connectivity for inline process control.

Features

• Multi‑Angle Side View for comprehensive defect coverage
• Optional AI‑powered defect detection algorithms
• Optional metrology-grade measurements with TRI AOM
• Optional 3D profile measurement via Laser Module
• Smart programming for fast setup and recipe management
• Industry 4.0 / Smart Factory ready

Optical System
Imaging Method: Dynamic Imaging
Top Camera: 4 MP high‑speed color camera
Angle Cameras: 4 angled side cameras
Imaging Resolution: 10 µm, 15 µm (factory setting)
Lighting: Multi‑phase RGB+W LED
3D Technology: 3D laser sensor (optional)
Max. 3D Range: N/A

Inspection Performance
Imaging Speed: 4 MP @ 10 µm: up to 60 cm²/sec
4 MP @ 15 µm: up to 120 cm²/sec

Motion Table & Control
X‑Axis Control: Ballscrew + AC servo with motion controller
Y‑Axis Control: Ballscrew + AC servo with motion controller
Z‑Axis Control: Ballscrew + AC servo with motion controller
X‑Y Axis Resolution: 1 µm

Board Handling
Max PCB Size (variants): TR7500 SIII Ultra: 510 x 460 mm; TR7500M SIII Ultra: 660 x 690 mm; TR7500 SIII Ultra DL: 510 x 310 mm x 2 lanes or 510 x 590 mm x 1 lane
PCB Thickness Range: 0.6 – 5 mm
Max PCB Weight: 3 kg (optional 5 kg)
Top Clearance: 25 mm (optional 48 mm)
Bottom Clearance: 40 mm
Edge Clearance: 3 mm (optional 4 mm / 5 mm)
Conveyor / Inline Height: 880 – 920 mm (optional 940 – 965 mm, SMEMA compatible)

Inspection Functions

• Detected component defects: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material
• Detected solder defects: Excess Solder, Insufficient Solder, Bridging, Through‑hole Pins, Lifted Lead, Golden Finger, Scratch / Contamination

Dimensions
WxDxH (variants): TR7500 SIII Ultra: 1100 x 1720 x 1710 mm; TR7500M SIII Ultra: 1250 x 1740 x 1710 mm; TR7500 SIII Ultra DL: 1365 x 1720 x 1710 mm (not including signal tower)
Weight: TR7500 SIII Ultra: 940 kg; TR7500M SIII Ultra: 992 kg; TR7500 SIII Ultra DL: 960 kg

Specifications / Notes

• Model: TR7500 SIII Ultra
• Imaging Method: Dynamic Imaging
• Top Camera: 4 MP high‑speed color camera
• Angle Cameras: 4 angled cameras (multi‑angle side view)
• Imaging Resolution: 10 µm, 15 µm (factory setting)
• Lighting: Multi‑phase RGB+W LED
• 3D Option: 3D laser sensor (optional)
• Imaging Speed: up to 60 cm²/sec @ 10 µm; up to 120 cm²/sec @ 15 µm
• Motion Control: Ballscrew + AC servo with motion controller (X/Y/Z)
• X‑Y Axis Resolution: 1 µm
• Max PCB Size (variants): see Board Handling
• PCB Thickness Range: 0.6 – 5 mm
• Max PCB Weight: 3 kg (optional 5 kg)
• Clearances & Inline Height: see Board Handling
• Detected component & solder defects: see Inspection Functions
• Optional: AI algorithms, TRI AOM metrology, and 3D laser module; some mechanical clearances and capacities available as options