Optical inspection system TR7700 SII Plus

digitalcameraautomatic

Overview
The TR7700 SII Plus is the world's first hybrid AOI designed for flexible inline inspection of PCBAs, capable of operating in both Stop-and-Go and Dynamic Imaging modes to optimize defect detection across assemblies. Select the inspection mode to match product complexity and production speed.

Key features

• Hybrid Stop-and-Go or Dynamic Imaging inspection
• Intelligent easy programming interface for fast recipe setup
• Rapid changeover with intelligent auto conveyor
• Foreign material and extra component inspection
• Selectable resolution: 6 µm, 10 µm, 15 µm; top camera options up to 12 Mpix

Optical system (AOI)

• Imaging method: Dynamic Imaging or Stop-and-Go (configurable)
• Top camera: 4 / 9 / 12 Mpix high-speed color camera (factory option)
• Lighting: Multi-phase RGB+W LED
• 3D: Not applicable
• Imaging resolutions: 6 µm, 10 µm, 15 µm

Inspection performance

• 4 Mpix @ 10 µm Dynamic Imaging: 60 cm²/sec
• 4 Mpix @ 15 µm Dynamic Imaging: 120 cm²/sec
• 9 Mpix @ 10 µm Dynamic Imaging: 72 cm²/sec
• 12 Mpix @ 6 µm Dynamic Imaging: 40 cm²/sec
• Stop-and-Go (4 Mpix): up to 4.5 FOV/sec

Motion & control

• X/Y drive: Ballscrew with AC-servo controllers
• X-Y axis resolution: 1 µm

Board handling

• Max PCB size (10/15 µm): 510 x 460 mm
• Max PCB size (6 µm): 400 x 400 mm
• DL version: 510 x 310 mm x 2 lanes or 510 x 590 mm x 1 lane (10/15 µm); 400 x 310 mm x 2 lanes or 400 x 400 mm x 1 lane (6 µm)
• PCB thickness: 0.6–5 mm
• Max PCB weight: 3 kg
• Top clearance: 25 mm (48 mm optional for 4 Mpix)
• Bottom clearance: 40 mm (100 mm optional)
• Edge clearance: 3 mm (5 mm optional)
• Conveyor: Inline, height 880–920 mm, SMEMA compatible

Inspection capabilities
Component defects detected:

• Missing
• Tombstoning
• Billboarding
• Polarity
• Rotation
• Shift
• Wrong marking (OCV)
• Defective
• Upside down
• Extra component
• Foreign material

Solder defects detected:

• Excess solder
• Insufficient solder
• Bridging
• Through-hole pins
• Lifted lead
• Golden finger
• Scratch/contamination

Dimensions & weight

• Single unit WxDxH: 1000 x 1400 x 1650 mm
• DL unit WxDxH: 1000 x 1500 x 1650 mm
• Weight: Single 600 kg / DL 650 kg

Applications

• Inline AOI for SMT and mixed-technology PCB assembly production
• Quality control for high-mix and low-volume manufacturing

Technical specifications (summary)

• Model: TR7700 SII Plus
• Top camera options: 4 / 9 / 12 Mpix
• Imaging resolutions: 6 µm, 10 µm, 15 µm
• Lighting: Multi-phase RGB+W LED
• Motion control: Ballscrew + AC-servo (X and Y)
• Max PCB size: up to 510 x 460 mm (10/15 µm) or 400 x 400 mm (6 µm)
• PCB thickness: 0.6–5 mm
• Max PCB weight: 3 kg