Die-attach die bonder Esec 2100 hS ix

fully-automaticfor the semiconductor industryhigh-accuracy

The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler. The Esec 2100 hS ix also incorporates the proven features of the 2100 i generation, such as the High Resolution Vision Systems and the Dual Dispensing Module. The Esec 2100 hS ix is the new generation High Speed Die Bonder providing now the best Cost of Ownership (CoO). New Generation Designs •High Resolution 4mega pixel Vision Systems •Motorized and Programmable Rail Strip Handler with three clamps, optimized for scratch free production •New reliable Strip push out to Magazine by Clamp •New Dual Universal Top Stack and Magazine Input Handler •New All-in-One Expansion unit for all frame sizes Optimized Productivity •Motorized Rail Strip Handler allowing working position as close to Wafer as possible •Superior and proven P&P design with High Performance P&P Y-axis and speed optimized trajectories •Speed Optimized Soft Pick and Bond Processes •Dual 5bar Pneumatic Dispense System with independent writing axis and pressure control Optimized Process Control •High Accuracy Production Modes •Low Contrast Object detection vision capability •Up to three calibrated Dual Color Light Sources per camera •Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers New Generation Options •Speed optimized Pneumatic Downholder System •High Precision Bond Head with highly accurate Theta Axis •High Accuracy closed loop P&P Z Axis •New High Resolution Up looking Vision System •Automatic Tool Setups and Optimization