Epoxy die bonder Datacon 2200 evo

for die-attachflip-chipautomated

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. •High Performance at High Accuracy •Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request) •High productivity, low cost-of-ownership •Up to 4 working heads in one machine •Multi-Chip Capability •Single pass production for complex products •Die attach, flip chip, multi-chip in one machine •Epoxy writing & stamping, flux dipping •Die pick from wafer, waffle pack, gel pack, feeder •Die place to carrier, boat, substrate, PCB, lead frame, wafer •Hot and cold processes supported: epoxy, soldering, thermo-compression •MCM, SiP, Hybrids •Most advanced modular platform concept •Production line tailored 100% to your needs •Ideal solution with smallest footprint possible