OverviewPlatinum-chip temperature sensors use thin-film technology and are designed for compact surface-mount applications. Sensors of the SMDFC design type feature a single-sided contact for face-down mounting (flip chip). Available nominal resistances: Pt100, Pt500 and Pt1000.
Highlights- AEC-Q200 qualification for selected sensors
- Compatible with automatic pick-and-place assembly
- SMD sizes 0805 and 1206
Technical dataDesign type: SMDFC-L-AuNi
Standard: DIN EN IEC 60751
Temperature range: -70 to +250 °C
Temperature coefficient: α = 3.850 × 10-3 °C-1 (between 0 and 100 °C)
Connection: Gold-plated nickel solder contact; nickel layer ≥ 1 µm; gold ≥ 40 nm; solderability per IEC / DIN EN 60068-2-58
Processing: Reflow soldering
Key properties: single-side contact for face-down mounting; suitable for automatic placement; gold-plated Ni solder contact; high measuring accuracy and long-term stability; standardized nominal values and tolerances; fast response behaviour
Areas of applicationSurface and ambient temperature measurement on printed circuit boards (e.g. in temperature probes, monitoring or compensation circuits).
Technical specifications- Design type: SMDFC-L-AuNi
- Standard: DIN EN IEC 60751
- Temperature range: -70 to +250 °C
- Temperature coefficient: α = 3.850 × 10-3 °C-1 (between 0 and 100 °C)
- Connection: Gold-plated nickel solder contact; nickel layer ≥ 1 µm; gold ≥ 40 nm; solderability per IEC / DIN EN 60068-2-58
- Processing: Reflow soldering
- SMD sizes: 0805 and 1206
- Available nominal resistances: Pt100, Pt500, Pt1000
- Special features: single-side contact for face-down mounting (flip chip); suitable for automatic placement; AEC-Q200 for selected sensors; high measuring accuracy and long-term stability