SPDT micro-switch FSK-14-5A-036

CQCC-US ULENEC

Product overview
Subminiature snap-action micro switch for control and signal applications. Rated currents: 5(2)A and 10(3)A. Voltage ratings: AC 125V / 250V, DC 30V. Certifications: UL, cUL (CSA), VDE, ENEC, CQC.

Size chart
Refer to the product size chart image provided on the product page.

Switch technical characteristics (table)
ITEM / (technical parameter) / Value
1) (Electrical Rating) / 0.1A 250VAC
2) (Operating Force) / 1.0 ~ 2.5N
3) (Contact Resistance) / ≤ 300 mΩ
4) (Insulation Resistance) / ≥ 100 MΩ (500 VDC)
5) (Dielectric Voltage) (between non-connected terminals) / 500 V / 0.5 mA / 60 s
(between terminals and the metal frame) / 1500 V / 0.5 mA / 60 s
6) (Electrical Life) / ≥ 50,000 cycles
7) (Mechanical Life) / ≥ 100,000 cycles
8) (Operating Temperature) / -25 ~ 105 °C
9) (Operating Frequency) / (electrical): 15 cycles; (mechanical): 60 cycles
10) (Vibration Proof) / Frequency: 10 ~ 55 Hz; Amplitude: 1.5 mm; Three directions
11) (Solder Ability) / More than 80% of immersed part shall be covered with solder; Soldering Temperature: 235 ± 5 °C (Immersing Time): 2 ~ 3 s
12) (Solder Heat Resistance) / (Dip Soldering): 260 ± 5 °C, 5 ± 1 s; (Manual Soldering): 300 ± 5 °C, 2 ~ 3 s
13) (Test Conditions) / Ambient Temperature: 20 ± 5 °C; Relative Humidity: 65 ± 5 % RH; Air Pressure: 86 ~ 106 kPa

Technical specifications

• Model: FSK-14-5A-036
• Current ratings: 5(2)A and 10(3)A
• Electrical rating example: 0.1A 250VAC
• Operating force: 1.0 ~ 2.5 N
• Contact resistance: ≤ 300 mΩ
• Insulation resistance: ≥ 100 MΩ (measured at 500 VDC)
• Dielectric strength: 500 V (non-connected terminals), 1500 V (terminals to metal frame); test current 0.5 mA, 60 s
• Electrical life: ≥ 50,000 cycles
• Mechanical life: ≥ 100,000 cycles
• Operating temperature range: -25 °C to 105 °C
• Operating frequency: electrical 15 cycles, mechanical 60 cycles
• Vibration: 10–55 Hz, amplitude 1.5 mm, three directions
• Solderability: >80% of immersed part covered; solder temp 235 ± 5 °C, immersion 2–3 s
• Solder heat resistance: dip soldering 260 ± 5 °C (5 ± 1 s); manual soldering 300 ± 5 °C (2–3 s)
• Test conditions: 20 ± 5 °C, 65 ± 5% RH, 86–106 kPa
• Certifications: UL, cUL (CSA), VDE, ENEC, CQC