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... PICMG COM Express® R3.1, Type 7 basic & compact modules 1 CEI 10Gb LAN Mini MEZZ slot, support 10GBASE-KR Ethernet MAC Speed Multiple Expansion: 1 PCIe x8, 2 PCIe x4, 1 PCIe x16, 1 SDIO Rich I/O: 1 10G LAN, 2 1G LAN, 4 USB 3.2 type A, 4 USB 2.0, 2 ...
DFI
... PICMG COM HPC® R2.0 Carrier Board Support Client size A, B, C Extend ATX Form Factor Multiple Displays: HDMI, DP, eDP Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 1 M.2 B Key, 1 M.2 E Key, 1 M.2 M key Rich I/O: 2 2.5 GbE, 2 USB 3.1, 2 USB 3.2, 4 USB ...
DFI
... COM Express® R3.1, Pin-out Type 6 & Type 10 Support Compact and Mini modules Multiple displays: VGA, LVDS, DP, eDP Rich I/O: 1 GbE, 3 USB 3.1, 4 USB 2.0 microATX form factor ...
DFI
Memory size: 8 GB
... Overview
The QRB812 is an Open Standard Module (OSM 1.1) System-on-Module from DFI based on the Qualcomm QRB5165 SoC. It is engineered for compact industrial and embedded applications such as AMR, robotics and drones, where multi-camera support, ...
DFI
Memory size: 0 GB - 192 GB
... Overview
The RPS9HC is a COM-HPC® Client Size C system-on-module family for high-performance embedded computing. It supports 14th and 13th Gen Intel® Core™ processors, DDR5 memory, multiple high-speed expansions and quad independent displays ...
DFI
Memory size: 4, 8, 16 GB
... The EHL701 is a Qseven System-on-Module by DFI for embedded and industrial applications, supporting Intel® Atom® x6000 series and Intel® N/J series processors in a compact 70 × 70 mm Qseven form factor.
Key features
- Form factor:
DFI
Memory size: 2, 4, 8 GB
The RK701 is a Qseven form-factor System-on-Module from DFI, powered by Rockchip RK3568 / RK3568J quad‑core Cortex‑A55 processors. It is designed for embedded and edge systems that require multi-display support, multiple expansion interfaces and configurable ...
DFI
Memory size: 0 GB - 96 GB
... The TGH960 is a COM Express® Basic (Type 6) system-on-module from DFI designed for industrial applications that require high I/O density, multiple expansion lanes and long CPU lifecycle support.
Highlights
- COM Express® Basic (Type
DFI
PICMG system-on-moduleMTH966
Memory size: 0 GB - 32 GB
... Overview
The MTH966 is a COM Express® Compact Type 6 system-on-module by DFI, built for industrial and embedded applications that require high compute density, multiple display outputs and extensive I/O expansion. It is powered by Intel® ...
DFI
Memory size: 0 GB - 16 GB
... Overview
The ASL968 is a COM Express® Compact Type 6 module from DFI designed for rugged and industrial embedded systems. It supports Intel® Atom® x7000RE (Amston Lake) and Intel® Core™ 3 / N-series (Twin Lake) processors, single-channel ...
DFI
... SOM200 Module Vortex86EX 400MHz CPU with 512MB RAM, SATA, Ethernet, 2xUSB, GPIO, PCI-E, -20 to 70C Operating Temperature CPU Processor Installed Vortex86EX Max CPU frequency 0.4 GHz Memory Form-factor DDR2 Socket Type Soldered ECC No Default ...
IPC2U GmbH
Memory size: 2 GB
... SMARC 2.1, NXP i.MX 8M Plus SoC Quad A53, 2GB RAM, 16GB eMMC, SDIO 3.0, HDMI, LVDS,2xGbE LAN, 2xUSB 3.0, 2xUSB 2.0, 3xI2C, 2xI2S, 5VDC System Architecture Max CPU frequency 1.6 GHz Memory Socket Type Soldered Assembly Fixed on Board Interfaces COM ...
IPC2U GmbH
... ARM Cortex-A53 NXP i.MX8M Mini, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth communication interfaces. Linux, Android, Ubuntu and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded plug ...
TechNexion Ltd.
... Main Features TechNexion AXON-IMX8M-MINI is a high-performance and reliability SoM featuring NXP i.MX8M Mini applications processor based on ARM Cortex-A53 and Cortex-M4 architecture that provides industry-leading computing performance, eciency and ...
TechNexion Ltd.
... Main Features TechNexion FLEX-IMX8M-MINI is a high-performance and reliability SoM featuring NXP i.MX8M Mini applications processor based on ARM Cortex-A53 and Cortex-M4 architecture that provides industry-leading computing performance, eciency and ...
TechNexion Ltd.
... ARM Cortex-A53 NXP i.MX8M, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth 5 communication interfaces. Linux, Android and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded plug and play ...
TechNexion Ltd.
... Main Features: The PICO-IMX7 design based on the NXP i.MX7 multi-market applications processor is designed to enable secure and portable applications within the Internet of Things. Pin-compatible with the Intel Edison for sensors and low-speed I/O, ...
TechNexion Ltd.
... EDM-IMX7 is an ARM Cortex-A7 + M4 NXP i.MX7 based, scalable single/dual core EDM Type 1 compact System on Module. Dual Gigabit LAN, Wi-Fi 802.11 a/b/g/n/ac and Bluetooth 5 communication interface. Targeting multimedia applications with LVDS, TTL, S/PDIF, ...
TechNexion Ltd.