{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Memory size: 0 GB - 16 GB
... Overview
- COM Express Type 6 compact module (95 mm × 95 mm) for embedded systems
- Supports Intel Atom® X Series / N-series and Intel Core™ processors — maximum CPU TDP 15 W
- Onboard LPDDR5 memory, configurable up to 16 GB
- Integrated
AAEON
Memory size: 0 GB - 16 GB
... Overview
COM-TWLC6 Rev.B is a COM Express Type 6 Compact size module designed for embedded systems and industrial applications, supporting Intel Atom® N-series and Intel Core™ processors with a maximum TDP of 15W.
Key features
- Intel
AAEON
Memory size: 0 GB - 16 GB
... Overview
COM-ASLC6 Rev.B — COM Express Type 6 compact module featuring Intel Atom® X Series processors. Designed for compact COM Express Type 6 applications with a 95 mm × 95 mm footprint.
Key features
- Intel Atom® X
AAEON
Memory size: 0 GB - 64 GB
... The COM-HPC Mini module HPC-ARHm is a compact, high-performance embedded computing module based on Intel® Core™ Ultra Processors (Series 1/2), designed for space-constrained applications requiring multiple I/O and high-speed interfaces.
Key ...
AAEON
Memory size: 0 GB - 16 GB
... COM Express Type 10 with 13th Generation Intel® Core™ U-series Processors - Onboard LPDDR5, up to 16GB - Onboard NVMe, up to 128GB (Optional) - eDP x 1, DDI x 1 - USB 2.0 x 8, USB 3.2 Gen 2 x 2 - PCIe [x1] x 4 - Intel® I226-IT GbE x 1 - COM Express Type ...
AAEON
Memory size: 0 GB - 16 GB
... COM Express Type 10 with Intel Atom® Processor X Series/Intel® Core™ i3/Processor N-series - Onboard LPDDR5, up to 16GB - Onboard eMMC, up to 64GB - LVDS colay eDP x 1, DDI x 1 - USB 2.0 x 8, USB 3.2 Gen 2 x 2 - PCIe [x1] x 4 - Intel® I226-V/IT 2.5GbE ...
AAEON
Memory size: 0 GB - 16 GB
... COM Express Type 10 with Intel® Core™ Ultra Series Processors - Onboard LPDDR5(X), up to 32GB - Onboard NVMe, up to 256GB - eDP x 1, DDI x 1 - USB 2.0 x 8, USB 3.2 Gen 2 x 2 - PCIe 4.0 [x1] x 4 - Intel® Ethernet Controller I226-V/IT 2.5GbE x 1 - COM Express ...
AAEON
Memory size: 8 GB
... Overview
The QRB812 is an Open Standard Module (OSM 1.1) System-on-Module from DFI based on the Qualcomm QRB5165 SoC. It is engineered for compact industrial and embedded applications such as AMR, robotics and drones, where multi-camera support, ...
DFI
PICMG system-on-moduleMTH966
Memory size: 0 GB - 32 GB
... Overview
The MTH966 is a COM Express® Compact Type 6 system-on-module by DFI, built for industrial and embedded applications that require high compute density, multiple display outputs and extensive I/O expansion. It is powered by Intel® ...
DFI
Memory size: 8, 16 GB
... Overview
The ADN9A2 is a COM Express® Mini (Type 10) System-on-Module from DFI, powered by Intel® Atom® / Core / Pentium / Celeron processors (Alder Lake‑N family). It is engineered for fanless embedded applications, supports LPDDR5 memory ...
DFI
Memory size: 0 GB - 32 GB
... Overview
The MTU9A2 is a COM Express Mini (Type 10) System-on-Module from DFI for embedded and industrial applications. It integrates Intel® Core™ Ultra (Meteor Lake U-series) processors, supports LPDDR5 memory up to 32GB, provides dual-display ...
DFI
Memory size: 8, 16 GB
... Intel® Atom® Processor Amston Lake Series Dual Channel LPDDR5 4800MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++)；Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC Rich I/O: 2 USB 3.1, 8 USB 2.0 High Speed ...
DFI
Memory size: 0 GB - 16 GB
... SMARC® Rel 2.1 compliant module with Intel Atom® Processors x7000RE Series for the Edge Video Resolution - Up to 4096x2160 @60Hz Audio HD audio and Soundwire / i2S audio interfaces Serial Ports - 2x UARTs 2x HS-UARTs Other Interfaces Up ...
SECO
Memory size: 0 GB - 16 GB
... SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) Video Interfaces - Integrated Intel® UHD Graphics driven by Intel® Xe ...
SECO
Memory size: 0 GB - 12 GB
... SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor Video Resolution - Primary display: FHD+ @120 fps Secondary display: up to 4k Ultra HD @60Hz Audio 2x I2S Serial Ports 2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX) Other Interfaces 2C Ultra ...
SECO
Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
Memory size: 0 GB - 32 GB
... Overview
SMARC® Rel. 2.1.1 module for edge and embedded applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for industrial and commercial use.
Highlights
- CPU
SECO
SMARC 2.1 computer-on-moduleSOM-SMARC-TWL
Memory size: 0 GB - 16 GB
... Overview
SMARC® Rel. 2.1 module (E08) featuring Intel® Core™ i3 and Intel® Processors N Series (codename Twin Lake). Compact 50 x 82 mm form factor tailored for industrial embedded applications; LPDDR5 soldered memory and broad I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 64 GB
... Overview
COM Express 3.1 Type 6 Compact module integrating Qualcomm Dragonwing IQ‑X Series processors in SiP‑A, featuring a Qualcomm Hexagon NPU up to 45 TOPS. Designed for embedded and edge AI applications requiring high CPU/GPU performance ...
SECO
Memory size: 0 GB - 16 GB
... SMARC® Rel. 2.1.1 Computer on Module with NXP i.MX 95 Applications Processors, delivering optimized processing and advanced Machine Learning acceleration for next-generation edge computing applications. Graphics - GPU Arm Mali-G310 V2 with 2D/3D ...
SECO
Memory size: 16 GB - 128 GB
... UCM-iMX95 is an ultra-miniature System-on-Module (SoM) with high performance graphics and image processing, optimised for industrial applications and offering up to 6 ARM Cortex A55 Cores. Unique multi-core architecture with upto 6 ARM Cortex-A55 CPU, ...
the best suppliers