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Memory size: 0 GB - 192 GB
... Overview
The RPS9HC is a COM-HPC® Client Size C system-on-module family for high-performance embedded computing. It supports 14th and 13th Gen Intel® Core™ processors, DDR5 memory, multiple high-speed expansions and quad independent displays ...
DFI
PICMG system-on-moduleMTH966
Memory size: 0 GB - 32 GB
... Overview
The MTH966 is a COM Express® Compact Type 6 system-on-module by DFI, built for industrial and embedded applications that require high compute density, multiple display outputs and extensive I/O expansion. It is powered by Intel® ...
DFI
Memory size: 0 GB - 16 GB
... Overview
The ASL968 is a COM Express® Compact Type 6 module from DFI designed for rugged and industrial embedded systems. It supports Intel® Atom® x7000RE (Amston Lake) and Intel® Core™ 3 / N-series (Twin Lake) processors, single-channel ...
DFI
Memory size: 8, 16 GB
... Overview
The ADN9A2 is a COM Express® Mini (Type 10) System-on-Module from DFI, powered by Intel® Atom® / Core / Pentium / Celeron processors (Alder Lake‑N family). It is engineered for fanless embedded applications, supports LPDDR5 memory ...
DFI
Memory size: 0 GB - 32 GB
... Overview
The MTU9A2 is a COM Express Mini (Type 10) System-on-Module from DFI for embedded and industrial applications. It integrates Intel® Core™ Ultra (Meteor Lake U-series) processors, supports LPDDR5 memory up to 32GB, provides dual-display ...
DFI
Memory size: 0 GB - 96 GB
... DDR5 6400MHz Dual-Channel SODIMM x 2, up to 96GB - VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 - USB 2.0 x 8, USB 3.2 Gen 2 x 4 - PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] - Intel® Ethernet Controller I226, 2.5GbE x 1 - 9V ~ 16V Power Input - ...
Memory size: 0 GB - 16 GB
... • Intel Atom® X Series CPU, max TDP 12W • DDR5 SODIMM x 1, up to 16GB (non-ECC) • Intel® Ethernet Controller I226-V/IT x 1 • SATA 6Gb/s x 2 • USB 2.0 x 8, USB 3.2 Gen 2 x 2 • PCIe [x4] (PCIe [x1] x 4 or [x2] x2), Up to 4 PCIe devices • COM Express Type ...
Memory size: 96 GB
... COM Express Type 6 Compact Size with Intel® Core™ Ultra Series Processors - DDR5 5600MHz Dual-Channel SODIMM x 2, up to 96GB - VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 - USB 2.0 x 8, USB 3.2 Gen 2 x 4 - PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] ...
Memory size: 0 GB - 12 GB
... SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor Video Resolution - Primary display: FHD+ @120 fps Secondary display: up to 4k Ultra HD @60Hz Audio 2x I2S Serial Ports 2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX) Other Interfaces 2C Ultra ...
SECO
Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
SMARC 2.1 computer-on-moduleSOM-SMARC-TWL
Memory size: 0 GB - 16 GB
... Overview
SMARC® Rel. 2.1 module (E08) featuring Intel® Core™ i3 and Intel® Processors N Series (codename Twin Lake). Compact 50 x 82 mm form factor tailored for industrial embedded applications; LPDDR5 soldered memory and broad I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 64 GB
... Overview
COM-HPC® Size A Client Module SOM-COM-HPC-A-ARL designed for Intel® Core™ Ultra Processors (Series 2, Arrow Lake H and U). Modular board in COM-HPC Size A form factor (120 x 95 mm) for industrial edge, automation, vision systems and ...
SECO
... Product overview
COM Express® 3.1 Type 6 compact module SOM-COMe-CT6-R8000 with AMD Ryzen™ Embedded 8000 Series processors (F07); small 95 x 95 mm form factor for embedded industrial applications.
Highlights
- CPU
SECO
Memory size: 0 GB - 64 GB
... Overview
COM Express 3.1 Type 6 Compact module integrating Qualcomm Dragonwing IQ‑X Series processors in SiP‑A, featuring a Qualcomm Hexagon NPU up to 45 TOPS. Designed for embedded and edge AI applications requiring high CPU/GPU performance ...
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express® 3.1 Type 6 Compact Module SOM-COMe-CT6-P100 featuring AMD Ryzen™ AI Embedded P100 Series processors. Compact 95 x 95 mm module designed for embedded applications requiring AI acceleration, multimedia and extensive I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express Rel. 3.1 Type 6 module featuring Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H), designed for high-performance embedded and edge systems requiring AI acceleration, multi-display support and extensive I/O.
Highlights
- CPU:
SECO
Memory size: 0 GB - 64 GB
... COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U) Graphics Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores (128 EU) Support up to 4 independent displays Audio HD Audio interface 2x ...
SECO
Memory size: 0 GB - 96 GB
... Product overview
COM Express Rel. 3.1 Type 6 module SOM-COMe-BT6-PTL based on Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H). Designed for embedded systems requiring high compute, integrated graphics, on-board AI acceleration ...
SECO
Memory size: 96 GB
... Product Overview
COM Express Type 6 Compact-size computer-on-module PCOM-B65C with AMD Ryzen™ Embedded 8000 family support. Designed for embedded and industrial applications requiring high CPU/GPU performance, extensive PCIe lanes and flexible ...
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