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... Overview
COM EXP
HEAT
SINK ACTIVE: COM Express Type 6 - COMe-A98-CT6
Heat Spreader +
Heat
Sink (ACTIVE) Horizontal Fins Orientation
Product details
Highly ...
SECO
... ambient temperature.
The
heat spreader is not a guaranteed standalone cooling solution; it is intended as a supplemental element to transfer thermal energy to another dissipation system (e.g.
heat
sinks, ...
SECO
... type: Active heat sink / heat spreader (supplemental cooling)
SECO
... COMe-C55-CT6 Heat Sink (ACTIVE)
Other information
- Availability:
SECO
... Overview
Passive
heat
sink designed for Q7 form factor modules, specifically the Q7-B03 configuration. Optimized for passive cooling of systems using Intel Atom E39xx series CPUs and supplied packaged for immediate ...
SECO
... Active Heat Sink (Part number QB03-DISS-3-C-PK) is designed for packaged Celeron / Pentium Nxxxx CPUs and intended as a supplemental heat spreader for Q7 modules. It facilitates heat ...
SECO
... indicate the suitable environmental temperature. The heat spreader is not a standalone cooling system and should be used only to transfer heat to an additional dissipation system ( heat sinks, ...
SECO
... supplemental means to transfer heat to an application-dependent dissipation system ( heat sinks, fans, heat pipes, etc.). The customer is responsible for designing and applying a cooling ...
SECO
... Description
Q7-C26
Heat
sink (active) - Packaged
Technical specifications
- Part Number: QC26-DISS-3-PK
- Commercial denomination (model): Q7-C26 Heat Sink
SECO
... suitable ambient temperature. The heat spreader is not intended as a guaranteed standalone cooling system; it should be used only as a supplemental means of transferring heat to other dissipation systems ( heat ...
SECO
... Active and passive heatsinks for processors The heat sinks are already mechanically adapted to the different processor types and can be attached by screw or adhesive fastening, depending on the version. ...
...
- TTV with integrated heatsink (one-piece construction) — eliminates interface and mounting-pressure variables.
- High power density — supports up to 12,800 W total power and up to 500 W/cm² heat flux
... is precisely CNC-machined to meet the structural and thermal demands of power electronic systems. Designed with integrated heat dissipation fins and accurate mounting features, it offers excellent durability, corrosion resistance, and ...
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