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Aluminum heat sink SBC-A44-pITX
for microprocessorcompactfor printed circuit boards

Aluminum heat sink - SBC-A44-pITX - SECO - for microprocessor / compact / for printed circuit boards
Aluminum heat sink - SBC-A44-pITX - SECO - for microprocessor / compact / for printed circuit boards
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Characteristics

Material
aluminum
Options
for electronics, compact, for printed circuit boards, for microprocessor

Description

Product overview
Passive heat sink SBC-A44-pITX SA44-DISS-2-PK (packaged)

Details
Highly integrated modules and boards deliver high computing performance in compact form factors. Miniaturization of ICs and high processor frequencies increase heat generation that must be dissipated to keep the CPU within its allowed temperature range. The operating temperature in the module/board Technical Features indicates the temperature range in which all parts of the heat spreader / heat sink must remain for SECO to guarantee functionality. These figures do not necessarily indicate suitable ambient temperature. The heat spreader is not intended as a guaranteed standalone cooling system; it must be used as a supplemental means to transfer heat to an application-dependent dissipation system (heat sinks, fans, heat pipes, etc.). The customer is responsible for designing and applying a cooling system capable of ensuring the heat spreader / heat sink temperature remains within the module’s specified range. After evaluating processor workload, enclosure and airflow, customers must perform system-level thermal analysis and develop an appropriate cooling solution for the assembled system.

Security & Compliance
  • Secure Boot: built-in Secure Boot to ensure system integrity from first startup.
  • OTA updates: remote and secure software update distribution.
  • Device monitoring: continuous monitoring of device status and activity.
  • Secure operating system: Yocto-based OS integration for customizable and secure builds.
  • Certified security: compliance with EN18031-1 for embedded systems.
  • Docker technology: isolated and flexible application management via containers.


Part Number / Packaging
  • SA44-DISS-2-PK: SBC-A44-pITX Heat Sink (PASSIVE) — packaged


Notes
  • Passive heat sink designed as a supplemental thermal transfer component, not a guaranteed standalone cooling solution.
  • The customer must evaluate processor workload, enclosure and airflow and design an appropriate cooling system for the assembled product.
  • Stock status on page: In stock.


Technical specifications
  • Part Number: SA44-DISS-2-PK
  • Model: SBC-A44-pITX
  • Commercial name: SBC-A44-pITX Heat Sink (PASSIVE)
  • Packaging: Packaged
  • Function: Passive heat sink / heat spreader for SBC modules and boards
  • Intended use: Supplemental thermal dissipation to be integrated with application-dependent cooling systems (heat sinks, fans, heat pipes, etc.)
  • Customer responsibility: System-level thermal analysis and cooling design required to ensure component temperatures remain within allowed ranges
  • Stock availability: In stock
  • Price indication on page: $0.00 (metadata shows 0, currency USD)

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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