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Aluminum heat sink COMe-C89-CT6
for microprocessorwith ventilatorfor printed circuit boards

Aluminum heat sink - COMe-C89-CT6 - SECO - for microprocessor / with ventilator / for printed circuit boards
Aluminum heat sink - COMe-C89-CT6 - SECO - for microprocessor / with ventilator / for printed circuit boards
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Characteristics

Material
aluminum
Options
for electronics, with ventilator, for printed circuit boards, for microprocessor

Description

Product Overview COMe-C89-CT6 Heat Sink (ACTIVE): Highly integrated modules and boards deliver high performance in compact dimensions. However, IC miniaturization and higher processor frequencies increase heat generation that must be dissipated to maintain the CPU within its allowable temperature range. The operating temperature specified in the module/board Technical Features indicates the temperature range in which all parts of the heat spreader / heat sink must remain for SECO to guarantee functionality. Therefore, these values do not necessarily indicate suitable environmental temperature. The heat spreader is not intended as a guaranteed standalone cooling system but should be used only as a supplemental means of transferring heat to another dissipation system (heat sinks, fans, heat pipes, etc.). It is the customer's responsibility to design and apply an application-dependent cooling system capable of ensuring that the heat spreader / heat sink temperature remains within the module's indicated range. After thorough evaluation of processor workload in the actual system application, enclosure and consequent airflow/thermal analysis, integrators must develop a suitable cooling solution for the assembled system.

Security & Compliance SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Security monitoring, patching and update automation are powered by Clea.
  • Secure Boot: Built-in Secure Boot to ensure system integrity from first startup.
  • OTA Updates: Remote and secure software update distribution for your devices.
  • Device Monitoring: Continuous monitoring of device status and activity with Clea.
  • Secure Operating System: Yocto-based OS integration for customizable and secure system builds.
  • Certified Security: Compliance with EN18031-1 standards for secure and reliable embedded systems.
  • Docker Technology: Isolated and flexible application management through containerization.


Packaging / Part Number
  • Part Number: MC89-DISS-3-PK
  • Description: COMe-C89-CT6 Heat Sink (ACTIVE) - Packaged
  • Availability: In stock
  • Price indicated on page: $0.00 USD


Technical specifications
  • Commercial name (model): COMe-C89-CT6
  • Part number: MC89-DISS-3-PK
  • Product type: Active heat sink / heat spreader (supplemental cooling)
  • Intended use: Supplemental means of transferring heat to other dissipation systems (heat sinks, fans, heat pipes, etc.)
  • Operating constraints: Heat spreader/heat sink must remain within the operating temperature range specified in the module/board Technical Features; those values do not necessarily indicate suitable environmental temperature
  • Thermal responsibility: System-level cooling design (workload evaluation, enclosure and airflow/thermal analysis) is required from the integrator to ensure correct operating temperature
  • Availability status: In stock
  • Price (amount): 0 (currency USD)
  • Packaging status: Packaged
  • Brand / Manufacturer: SECO

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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