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Aluminum heat sink Q7-B03
for microprocessorwith ventilatorcompact

Aluminum heat sink - Q7-B03 - SECO - for microprocessor / with ventilator / compact
Aluminum heat sink - Q7-B03 - SECO - for microprocessor / with ventilator / compact
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Characteristics

Material
aluminum
Options
for electronics, thermally conductive, compact, with ventilator, for printed circuit boards, for microprocessor, for forced convection

Description

Overview
The Q7-B03 Active Heat Sink (Part number QB03-DISS-3-C-PK) is designed for packaged Celeron / Pentium Nxxxx CPUs and intended as a supplemental heat spreader for Q7 modules. It facilitates heat transfer to an external dissipation system (heat sinks, fans, heat pipes) and is not specified as a standalone cooling solution.

Details
Highly integrated modules and boards deliver significant computing performance within compact footprints. IC miniaturization and higher processor frequencies increase thermal dissipation demands that must be managed to keep the CPU within the module's allowed operating temperature range. The operating temperature given in the module/board Technical Features refers to the allowable temperature range for the heat spreader/heat sink surfaces to guarantee SECO functionality, and does not necessarily indicate permissible ambient temperature. The heat spreader should be used only as a supplemental means to transfer heat toward a primary dissipation system. It is the customer's responsibility to design and implement an application-specific cooling solution capable of maintaining the heat spreader/heat sink temperature within the module's specified range. After evaluating the processor workload in the target application, system enclosure and resulting airflow, customers must perform thermal analysis and develop an appropriate cooling strategy for the assembled system.

Security & Compliance
  • Secure Boot: Built-in Secure Boot to ensure system integrity from first startup.
  • OTA Updates: Remote and secure distribution of software updates for devices.
  • Device Monitoring: Continuous monitoring of device status and activity with Clea.
  • Secure Operating System: Yocto-based OS integration for customizable and secure system builds.
  • Certified Security: Compliance with EN18031-1 standards for secure and reliable embedded systems.
  • Docker Technology: Isolated and flexible application management through containerization.


Technical specifications
  • Part Number: QB03-DISS-3-C-PK
  • Commercial name: Q7-B03 Heat Sink (ACTIVE)
  • Product designation: Heat Sink (ACTIVE) for Celeron / Pentium Nxxxx CPUs Packaged
  • Availability: In stock
  • Price (listed): 0 USD

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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