Microprocessor heat sink Q7-B03for IPCfor printed circuit boardsfor electronics
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Characteristics
- Options
- for microprocessor, for IPC, for printed circuit boards, for electronics
Description
Overview
Passive heat sink designed for Q7 form factor modules, specifically the Q7-B03 configuration. Optimized for passive cooling of systems using Intel Atom E39xx series CPUs and supplied packaged for immediate integration.
Applications
Key features
Compatibility
Technical specifications
Part Number
QB03-DISS-2-I-PK
Passive heat sink designed for Q7 form factor modules, specifically the Q7-B03 configuration. Optimized for passive cooling of systems using Intel Atom E39xx series CPUs and supplied packaged for immediate integration.
Applications
- Embedded industrial controllers
- Fanless systems and ruggedized equipment
- IoT gateways and edge computing modules
Key features
- Passive heat sink (no active fan)
- Form factor: Q7 / Q7-B03
- Compatible with Intel Atom E39xx series CPUs
- Delivered packaged for straightforward installation
- Suitable for passive cooling strategies in constrained or sealed enclosures
Compatibility
- Commercial model: Q7-B03
- CPU compatibility: Intel Atom E39xx series
Technical specifications
- Part Number: QB03-DISS-2-I-PK
- Product type: Heat Sink (PASSIVE)
- Form factor: Q7 (Q7-B03)
- Packaging: Packaged
- Availability status: In stock
- Price indicated: $0.00 (USD) on page
Part Number
QB03-DISS-2-I-PK
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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