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Aluminum heat sink Q7-C26
for microprocessorwith ventilatorfor printed circuit boards

Aluminum heat sink - Q7-C26 - SECO - for microprocessor / with ventilator / for printed circuit boards
Aluminum heat sink - Q7-C26 - SECO - for microprocessor / with ventilator / for printed circuit boards
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Characteristics

Material
aluminum
Options
for electronics, with ventilator, for printed circuit boards, for microprocessor

Description

Product Overview
Q7 HEAT SINK: Q7-C26 Heat Sink (ACTIVE) Packaged

Part Number
QC26-DISS-3-PK

Availability
In stock

Thermal information
Highly integrated modules and boards offer very high performance within small dimensions. The miniaturization of ICs and the high operating frequencies of processors lead to increased heat generation that must be dissipated to keep the CPU within its allowed temperature range. The operating temperature specified in the technical features of the module/board indicates the temperature range in which all parts of the heat spreader / heat sink must remain for SECO to guarantee functionality; these figures do not necessarily indicate a suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system but should be used as a supplemental means to transfer heat to another dissipation system (for example heat sinks, fans, heat pipes). It is the customer’s responsibility to evaluate processor workload in the actual system application, the system enclosure and resulting airflow/thermal analysis, and to design and apply an application-dependent cooling solution capable of keeping the heat spreader / heat sink temperature within the indicated range for the assembled system.

Security & Compliance
  • Secure Boot: Built-in Secure Boot to ensure system integrity from first startup.
  • OTA Updates: Remote and secure software update distribution for devices.
  • Device Monitoring: Continuous monitoring of device status and activity.
  • Secure Operating System: Yocto-based OS integration for customizable and secure system builds.
  • Certified Security: Compliance with EN18031-1 standards for secure and reliable embedded systems.
  • Docker Technology: Isolated and flexible application management through containerization.

Packaging / Description
Q7-C26 Heat sink (active) - Packaged

Technical specifications
  • Part Number: QC26-DISS-3-PK
  • Commercial denomination (model): Q7-C26 Heat Sink (ACTIVE)
  • Type: Active heat sink / heat spreader (supplemental cooling)
  • Packaging: Packaged
  • Category: Heat Spreaders
  • Availability: In stock
  • Price (excl. taxes): 0 (currency USD)
  • Price unit: piece
  • Product internal id (price box data-product-id): 9776

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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