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Aluminum heat sink COMe-C42-BT7
straight finfor microprocessorcompact

Aluminum heat sink - COMe-C42-BT7 - SECO - straight fin / for microprocessor / compact
Aluminum heat sink - COMe-C42-BT7 - SECO - straight fin / for microprocessor / compact
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Characteristics

Material
aluminum
Shape
straight fin
Options
for electronics, compact, for printed circuit boards, for microprocessor

Description

Overview
COM Express Type 7 Basic — COMe-C42-BT7 Heat Sink (ACTIVE) supplied packaged as an accessory for industrial embedded systems to support thermal management.

Product description
Highly integrated modules and carrier boards deliver high performance in compact dimensions. Miniaturization of ICs and high processor frequencies increase heat generation that must be dissipated to keep the CPU within its allowable temperature range. The operating temperature indicated in the module/board technical specifications defines the temperature range in which the heat spreader / heat sink must remain for proper functionality. These values do not necessarily represent the permissible ambient temperature.

The heat spreader is not a guaranteed standalone cooling solution; it is intended as a supplemental element to transfer thermal energy to another dissipation system (e.g. heat sinks, fans, heat pipes). It is the customer’s responsibility to design and implement an application-specific cooling system that ensures the heat spreader / heat sink temperature remains within the module’s specified range. Customers must evaluate processor workload in the actual system, enclosure characteristics and airflow, and perform appropriate thermal analysis to develop a suitable cooling solution for the assembled system.

Part Numbers
  • MC42-DISS-3-PK-1 — COMe-C42-BT7 Heat Sink (ACTIVE) - Packaged
  • MC55-DISS-1-PK — COM Express Type 6 - COMe-C55-CT6 Heat Spreader (PASSIVE) - Packaged

Availability & Price
  • Availability: In stock
  • Listed price: $0.00 USD

Security & Compliance
  • Secure Boot — Built-in Secure Boot to ensure system integrity from first startup.
  • OTA Updates — Secure remote software update distribution for deployed devices.
  • Device Monitoring — Continuous monitoring of device status and activity.
  • Secure Operating System — Yocto-based OS integration for customizable and secure system builds.
  • Certified Security — Compliance with EN18031-1 standards for secure embedded applications.
  • Docker Technology — Isolated and flexible application management through containerization.

Technical specifications
  • Brand: SECO
  • Commercial name (model): COMe-C42-BT7
  • Main reference / SKU: MC42-DISS-3-PK
  • Related references: MC42-DISS-3-PK-1, MC55-DISS-1-PK
  • Product type: Heat Sink (ACTIVE) — heat spreader accessory for COM Express modules
  • Packaging: Packaged
  • Compatibility / Target module: COM Express Type 7 Basic / COMe-C42-BT7
  • Intended use: Supplemental heat dissipation element to be used in combination with other dissipation systems (heat sinks, fans, heat pipes, etc.)
  • Thermal responsibility: Customer must evaluate processor workload, system enclosure and airflow and design an application-dependent cooling solution to keep temperatures within module specifications
  • Product category: Heat Spreaders / Heat Sinks (Development Kits & Accessories)
  • Price (listed): $0.00 USD
  • Availability status: In stock
  • EAN:

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Dev Kits, Carrier Boards and Accessories

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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