Aluminum heat sink Q7-C26

compactfor printed circuit boardsfor electronics

Product overview
Passive heat sink designed for Q7-C26 modules, supplied packaged under part number QC26-DISS-2-PK. Intended as a supplemental dissipation element for embedded Q7 module applications.

Detailed description
Highly integrated modules and boards deliver high performance in compact dimensions, increasing heat density. This passive heat sink transfers heat from the module to external dissipation systems. The operating temperature limits shown in the module/board technical features define the maximum temperature range for the heat spreader/heat sink to guarantee functionality; they do not necessarily indicate environmental suitability. The heat sink is not a guaranteed standalone cooling solution and should be combined with additional dissipation (heat sinks, fans, heat pipes, chassis conduction, etc.). It is the customer’s responsibility to design and validate an application-specific cooling strategy, including evaluation of processor workload, enclosure characteristics and airflow/thermal analysis, to ensure component temperatures remain within specified ranges.

Part number

• QC26-DISS-2-PK — Q7-C26 Heat sink (passive) - Packaged

Availability

• In stock

Notes

• Passive heat sink intended as supplemental heat dissipation; not a guaranteed standalone cooling solution.
• Customers must evaluate system workload, enclosure and airflow and design an appropriate cooling solution.

Technical specifications

• Product type: Heat sink (passive)
• Model / commercial designation: Q7-C26
• Part number: QC26-DISS-2-PK
• Packaging: Packaged
• Intended use: Supplemental heat transfer to external dissipation systems (heat sinks, fans, heat pipes, chassis conduction, etc.)
• Operating constraints: Must remain within module/board specified operating temperature ranges; actual environmental suitability depends on system design
• Availability: In stock
• Brand: SECO
• Price (listed): 0 (see price field)