Microprocessor heat sink COMe-C55-CT6

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Overview
Highly integrated modules and boards deliver strong performance in compact dimensions. Miniaturization of ICs and high processor frequencies increase heat generation that must be dissipated to keep the CPU within its allowable temperature range. The operating temperature listed in the module/board technical features indicates the temperature range that all parts of the heat spreader/heat sink must remain within for SECO to guarantee functionality. These values do not necessarily correspond to suitable ambient temperature. The heat spreader is not a guaranteed standalone cooling system and is intended only as a supplemental thermal transfer component to be integrated with an additional dissipation system (heat sinks, fans, heat pipes, etc.). It is the customer's responsibility to design and apply an application-dependent cooling system capable of keeping the heat spreader/heat sink temperature within the module's specified range. After evaluating processor workload, enclosure and airflow/thermal analysis, customers must develop and validate an appropriate cooling solution for the assembled system.

Part numbers

• PN-8: COMe-C55-CT6 Heat Sink (ACTIVE)
• MC55-DISS-3-PK: COM Express Type 6 - COMe-C55-CT6 Heat Sink (ACTIVE) Packaged

Other information

• Availability: In stock
• Product type: Active heat sink / heat spreader
• Intended use: supplemental thermal transfer component to be integrated with an additional dissipation system (heat sinks, fans, heat pipes, etc.)
• Customer responsibility: perform thermal analysis and provide an application-dependent cooling solution to maintain component temperatures within allowed ranges

Technical specifications

• Product title: MC55-DISS-3-PK
• Commercial model: COMe-C55-CT6 Heat Sink (ACTIVE)
• Part numbers: PN-8; MC55-DISS-3-PK
• Form factor / compatibility: COM Express Type 6 (for COMe-C55-CT6 module)
• Packaging: Packaged
• Availability: In stock
• Price on page: $0.00 (USD)

Safety and compliance

• Secure Boot — Built-in Secure Boot to ensure system integrity from first startup
• OTA Updates — Remote and secure software update distribution
• Device Monitoring — Continuous monitoring of device status
• Secure Operating System — Yocto-based OS integration
• Certified Security — Compliance with EN18031-1 standards
• Docker Technology — Containerization for isolated application management

Usage notes
The heat spreader / heat sink must be used only as a supplemental thermal transfer component. Designers must perform system-level thermal analysis, evaluate processor workload and enclosure airflow, and implement a validated cooling solution to ensure temperatures remain within the module's specified operating range.