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Microprocessor heat sink Q7-B03
for electronicswith ventilatorfor printed circuit boards

Microprocessor heat sink - Q7-B03 - SECO - for electronics / with ventilator / for printed circuit boards
Microprocessor heat sink - Q7-B03 - SECO - for electronics / with ventilator / for printed circuit boards
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Characteristics

Options
for microprocessor, for electronics, with ventilator, for printed circuit boards

Description

Product overview
Highly integrated modules and boards deliver high performance in small form factors. Miniaturization and higher processor frequencies generate significant heat that must be dissipated to keep the CPU within its specified operating range. The operating temperature in the module/board technical features refers to the allowable temperature range for the heat spreader/heat sink to guarantee functionality and does not necessarily indicate the suitable environmental temperature. The heat spreader is not a standalone cooling system and should be used only to transfer heat to an additional dissipation system (heat sinks, fans, heat pipes, etc.). Customers are responsible for designing and implementing an application-specific cooling solution based on processor workload, system enclosure and thermal/airflow analysis to ensure the heat spreader/heat sink temperature remains within the module's specified range.

Compatibility
Q7-B03 Heat Sink (ACTIVE) for Atom E39xx CPUs — Packaged

Security & Compliance
  • Secure Boot: Built-in Secure Boot to ensure system integrity from first startup.
  • OTA Updates: Remote and secure software update distribution for devices.
  • Device Monitoring: Continuous monitoring of device status and activity with Clea.
  • Secure Operating System: Yocto-based OS integration for customizable and secure system builds.
  • Certified Security: Compliance with EN18031-1 standards for secure and reliable embedded systems.
  • Docker Technology: Isolated and flexible application management through containerization.


Part Number
Part Number: QB03-DISS-3-I-PK
Description: Q7-B03 Heat Sink (ACTIVE) for Atom E39xx CPUs Packaged

Technical specifications
  • Brand: SECO
  • Part Number: QB03-DISS-3-I-PK
  • Commercial denomination: Q7-B03
  • Product type: Heat Sink (ACTIVE)
  • Compatible processors: Intel Atom E39xx series
  • Packaging: Packaged
  • Intended use: Supplemental heat transfer to additional dissipation systems (heat sinks, fans, heat pipes, etc.)
  • Availability: In stock
  • Price (excl. tax): 0 USD

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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