Eutectic die bonder Esec 2100 hS

for die-attachepoxyautomated

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform concept won the prestigious Swiss Technology Award. Leading Edge Machine Concept •Real time process monitoring through 4 live images of process zone •Constant status control with real time wafer, strip and magazine viewer •Efficient learning and error recovery thanks to context sensitive online help •Real time process monitoring through 4 live images of process zones •Constant status control with real time wafer, strip and magazine viewer •Efficient learning and error recovery thanks to context sensitive online help Highest Speed at 20 µm Accuracy •Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements •New "light&rigid" pick & place structure, advanced trajectory control as well as a liquid cooling system ensuring excellent accuracy at highest speed •Placement accuracy down to 15 µm (3 sigma) using High Accuracy Mode •Tool-less exchange of product specific parts for fastest product changeovers •Teach and setup wizards and parameter teach verification eliminate setup errors •Recipe transfer from machine to machine enables fast conversion •Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic