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epoxy die bonder
epoxy die bonder
MDP-200

The MD-P200 series of Die Bonders from PANASONIC, offers services with high productivity levels due to the synchronous head system that gives services which go beyond what a conventional die ...

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Panasonic Factory Automation Company
flip-chip die bonder
flip-chip die bonder
Datacon 2200 evo

The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications on die attach and clip chips that need utmost versatility. It has an incorporated dispenser, a mechanized ...

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BE Semiconductor Industries
epoxy die bonder
epoxy die bonder
ISTACK S+

The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ ...

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Kulicke & Soffa
epoxy die bonder / automated
epoxy die bonder
6532HP

Developed for the demanding needs for the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum ...

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PALOMAR TECHNOLOGIES
thermal die bonder
thermal die bonder
PP5

... IR Sensor, Laser diodes, strength gage Model: PP5 with table on the top Accuracy: Up to 5 µm, Up to 1 µm (option flip) Die size: minimum 200*200 µm, maximum 50*50 mm Substrate size: Up to 150x500 mm Part fixture: ...

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unitemp
flip-chip die bonder
flip-chip die bonder
AL300

The machines of fi conTEC‘s 300 series are small footprint yet high precision die bonders. They are designed to break down complex assembly processes into standardized recurring sub-processes for low ...

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ficonTEC Service GmbH
wafer bonder
wafer bonder

OAI Automation Systems offer a wide range of wafer handling solutions. Systems can be configured for 50mm (2") compound semiconductor wafers up to 300mm silicon wafers. The ergonomic operator interface and Windows NT platform allow easy ...

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OAI
wafer bonder
wafer bonder
XBS200

Wafer Bonding Platform for High-Volume Production The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding ...

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Suss MicroTec
flip-chip die bonder
flip-chip die bonder
AFM Series

... the next generation. TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process). Low-energy bonding enables bonding with 30% to 50% less energy ...

fully-automatic die bonder / for micro assembly
fully-automatic die bonder
fab1 und fab+

... requested: SPEED! Fab is a completely new design, regarding software as well as hardware. Some Highlights Massive aluminum die cast base with integrated linear servos and servo driven Z-axis Rugged steel frame Inline ...

semi-automatic die bonder / flip-chip / for micro assembly
semi-automatic die bonder
HFB

Semi-automatic Die Bonder-System in rigid granite frame arrangement with a high bond force capability, second z - axis and a beam splitter optics for accurate alignment. Highlights: - Bond force up ...

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Paroteq
sub-micron die bonder / fully-automatic / automated / high-accuracy
sub-micron die bonder
FINEPLACER® femto 2

Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very ...

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Finetech
flip-chip die bonder / epoxy
flip-chip die bonder
HB70

Pick & Place Pick Microchip from Die-Carrier and place it to your surface Epoxy Dispensing Simple and exact handling Inspection Visual inspection of microassembly for example from soldering, bonding or flip ...