SMT pick-and-place machine SIPLACE CA2

compacthigh-speed

Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system. As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process both SMDs supplied from changeover tables and feeders as well as dies taken directly from the sawn wafer in a single work step. By integrating the complex die bonding process into the SMT line it eliminates the need for special machines in production. With reduced personnel deployment, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the perfect match for the Intelligent Factory. Placement directly from the wafer: more cost-effective and sustainable Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. In just one year, 800 km of tape can be saved with 24/7 SiP production. Two worlds in one machine: The multifunctional SIPLACE CA2 places components directly from the wafer (die attach and flip-chip) and from tape-and-reel feeders. Advanced packaging all-rounder: The perfect solution for wafer level packaging, panel level packaging, system in package (SiP), embedded PCB and power semiconductor applications. Unique flexibility: Wafer system holds up to 50 different wafers with wafer swaps taking less than 13 seconds („full multi-die capability").