Single- or double-sided PCB pick-and-place machine

SMTwith optical alignment systemautomatic

Overview
SIPLACE placement machines are market and technology leaders in terms of precision, flexibility, process stability and production speed. This leadership position results from a broad spectrum of intelligent technologies working together to ensure maximum yields and minimal reject rates. Get more from your SMT line with SIPLACE smart features:

SIPLACE Smart Pin Support
SIPLACE machines can place support pins automatically to prevent bending and vibrations of large PCBs during assembly; the system can be retrofitted and reduces manual assists during product changeovers.
Your benefits:

• The pins get set automatically and precisely at the positions defined in SIPLACE Pro.
• A slight blast of air from the pin removes dirt particles prior to placement to reliably prevent contamination.
• 3D visualization detects and prevents collisions of sensitive components already during the programming phase.
• All pins are continuously checked for their correct position and height.
• The system reduces product changeover time by roughly 20 minutes and often pays back quickly.

SIPLACE Vision System
The SIPLACE vision system inspects each component individually and in minute detail; only flawless parts make it to the PCB and the machine automatically compensates for offsets.
Your benefits:

• Each component is inspected individually.
• High-resolution imaging makes each detail visible, not just outlines.
• Interactive user interface allows teaching a component on the station within 10 seconds.

Integrated component sensor
A laser integrated into the placement head checks presence of each component before and after pickup and before and after placement, detecting missing components (empty tape pocket or fallen off nozzle) to prevent downstream faults and scrap.
Your benefits:

• Instant detection of missing components.
• Consistently high placement quality.
• Avoidance of further processing of incompletely assembled PCBs.

Detection of component heights and PCB warps
Laser sensors and photoelectric barriers determine PCB warping and component heights during placement; the resulting PCB profile is stored for the ongoing production run to compensate offsets automatically.
Your benefits:

• Consistently high placement quality even with warped PCBs.
• Properly adjusted placement force that does not damage components.
• PCB measurement during the placement process with no loss of performance due to separate measurements.

Closed-loop pickup correction
The SIPLACE platform recognizes offsets in component pickups and compensates by adjusting XY positions and nozzle rotations for subsequent pickups, increasing pickup reliability and preventing unnecessary discards.
Your benefits:

• Continuous optimization of component pickups.
• Increased pickup rate.
• Prevention of unnecessary discards.
• Consistently high placement quality without performance loss.

Automatic pitch detection
SIPLACE placement machines determine pitch values for 8-mm feeders automatically by iteratively testing the smallest pitches and increasing if pickups fail, allowing the machine to adapt after tape changes.
Your benefits:

• Automatic pickup rate improvement.
• Avoidance of component discards and waste.
• Relieves operators from manual pitch adjustments.

Characteristics / technical specifications

• High-resolution cameras and component-specific lighting for detailed component inspection.
• Integrated laser component sensor checks pickup and placement before and after each operation.
• Photoelectric barriers and laser sensors for PCB warp and component height detection; PCB profile storage for run compensation.
• Automatic pin placement with 3D visualization and continuous position/height verification.
• Closed-loop pickup correction via XY and rotary nozzle adjustments to determine and correct component/nozzle center points.
• Automatic pitch detection algorithm for 8-mm feeders (iterative pitch testing and adjustment).
• Faulty components are discarded automatically; offsets are compensated to maintain throughput.