BGA pick-and-place machine SIPLACE V

SMTfor camerasmodular

Overview
The newly designed SIPLACE V platform combines leading performance, maximum flexibility and highest precision with full compatibility to existing SMT lines. At the same time, it is consistently designed to meet the requirements of the future – for further automation, efficient big data processing and long-term investment security.

Performance
The SIPLACE V platform increases SMT placement performance by up to 30% under real production conditions while combining high placement performance, component flexibility, and full compatibility for intelligent electronics manufacturing. In key industries – from high-mix, low-volume to high-speed production – it achieves a performance increase of up to 30 percent under real production conditions.

100 % process excellence

• Maximum precision: New linear drives and measuring systems with higher resolution for precise placement down to 25 µm @ 3σ.
• Intelligent sensor technology: Closed-loop control adjusts placement force in real time for consistently high quality with every component.
• Perfect alignment: Individually rotatable nozzle segments ensure exact angular positions and error-free placement.
• Automated quality assurance: High-resolution cameras check every component; variable pick-up positions and PCB warping are automatically compensated.
• Seamless traceability: Complete traceability of all components – ideal for automotive applications.
• Process reliability for complex components: Smart Pin Support and improved OSC processing guarantee stable results even with special components.

Unlimited flexibility

• Comprehensive range of components: From ultra-small 016008M components to large-format odd-shaped components (OSCs), including BGAs.
• Three placement heads for every application: Easy replacement during operation thanks to a new universal head interface.
• Extended feeder capacity: Up to 45 × 8 mm feeders can be used at each location – supports all SIPLACE X feeders, linear dipping units, power connectors, SIPLACE glue feeders and SIPLACE measuring feeders.
• Flexible transport system: Choice of single or double transport for different PCB sizes and production requirements.
• New SIPLACE V Tray Unit: Slim and space-saving tray unit for JEDEC trays.
• Flexible machine configuration: Choice of single or double gantry version, single or dual conveyor, optional 3D Koplan module and additional cameras.

Ready for the future

• Open system architecture: Modular, prepared for future pick-and-place head generations and future process requirements.
• High-speed data communication: Gigabit Ethernet for maximum bandwidth, minimal latency, seamless M2M communication and efficient big data management and analysis functions.
• AI and data analysis capable: Integrative data concept creates the basis for AI-supported process optimisation and predictive quality control.
• Automation ready: Designed for further automation steps in electronics manufacturing.
• Extended platform variants: SIPLACE V L is a version for large-format PCBs and high components up to 55 mm.
• Seamless software integration: Compatibility with WORKS Software Suite and Factory Solutions.

Placement heads

• Placement Head CP20: High-speed collect-and-place placement head. Up to 52,500 cph at 25 µm @ 3σ precision. For components ranging from 016008M to ~8.2 mm × 8.2 mm × 4 mm. Placement force range 0.5 N to 4.5 N.
• Placement Head CPP: Allrounder for mixed assemblies. Switches between collect-and-place, pick-and-place or mixed mode via software. For components from 01005 to 50.0 mm × 40.0 mm × 15.5 mm. Speed up to 28,000 cph, accuracy up to ±25 µm @ 3σ.
• Placement Head TWIN VHF: Specialist for large and heavy components. Placement force up to 100 N; handles components up to ~200 × 150 × 25/50 mm. Speed up to 6,000 cph. Accuracy up to ±20 µm @ 3σ. Component weight up to 300 g (TWIN VHF).

SIPLACE V at a glance (highlights)

• Up to 30% more real performance in key industries.
• Significantly higher performance under real production conditions.
• Maximum flexibility, even in high-speed applications.
• Proven quality assurance features and seamless traceability.
• Full compatibility with existing ASMPT hardware and software.
• Maximum future-proofing and investment security.

Technical table (summary)
Placement speed: 105,000 cph
Standard accuracy: ±25 µm @ 3 σ
PCB dimension (L × W): up to 850 mm × 610 mm Single-lane mode; up to 400 mm × 280 mm Dual-lane mode; up to 700 mm × 530 mm Dual as single
Feeder slots: up to 90 x 8 mm tape feeders
Machine dimensions (L × W × H): 1.1 m × 2.4 m × 1.6 m

Caractéristiques / spécifications techniques

• Model: SIPLACE V
• Placement speed: 105,000 cph
• Standard placement accuracy: ±25 µm @ 3 σ
• Supported PCB sizes: single-lane up to 850 × 610 mm; dual-lane up to 400 × 280 mm; dual-as-single up to 700 × 530 mm
• Feeder capacity: up to 90 × 8 mm tape feeders (per machine)
• Machine footprint: 1.1 m × 2.4 m × 1.6 m (L × W × H)
• Head options: CP20 (high-speed, up to 52,500 cph), CPP (flexible allrounder, up to 28,000 cph), TWIN VHF (high-force, up to 100 N, for large components)
• Key features: closed-loop force control, rotatable nozzle segments, Smart Pin Support, OSC package processing, SIPLACE Measuring Feeder, SIPLACE Glue Feeder, linear dipping unit, SIPLACE V Tray Unit, LED centering, stationary component cameras (Type 53GigE / 56GigE), on-board PCB inspection, 3D coplanarity sensor, Smart Nozzle Reader
• Connectivity: Gigabit Ethernet, supports IPC-HERMES-9852, IPC-CFX and integration with WORKS Software Suite and SMT Analytics