SMT pick-and-place machine SIPLACE TX micron series

With the SIPLACE TX micron, you run advanced packaging and high-density applications with the performance of state-of-the-art SMT technology (up to 93,000 cph) and unprecedented accuracy. A standard accuracy of 20 μm @ 3 sigma and accuracy classes of 15 and 10 μm @ 3 sigma allow to reliably mount placement gaps of as little as 50 μm. The performance and upgradeability of the SIPLACE TX micron protect your investment. Accuracy combined with efficiency: An accuracy rating of 10 µm @ 3 sigma and performance that sets new standards for advanced packaging and system-in-package (SiP) applications. Top placement quality: Developed for extremely tight component spacing, smallest ball diameters and sensitive dies to ensure maximum process quality. Maximum protection for sensitive components: Individual adjustments of force, motion profiles and placement parameters for improved DPM rates. Seamless traceability: Full tracking from tape to final product ensures maximum process control. Component inspection for maximum yields: Accurate component sensor and advanced die-crack and die-chipping detector ensure maximum quality. Maximum flexibility for any production: Extended conveyor options for thick and/or warped boards, JEDEC trays and J-boats deliver total flexibility for individual production requirements. Flux detection & inspection: Optical control ensures maximum yields when using dipping units. Cleanroom-compatible & standard-compliant: Certified according to Class 7 (DIN EN ISO 14644-1) and SEMI S2/S8 – ideal for high-tech environments.