SMT pick-and-place machine SIPLACE TX micron series

With the SIPLACE TX micron, you run advanced packaging and high-density applications with the performance of state-of-the-art SMT technology (up to 93,000 cph) and unprecedented accuracy. A standard accuracy of 20 μm @ 3 sigma and accuracy classes of 15 and 10 μm @ 3 sigma allow to reliably mount placement gaps of as little as 50 μm. The performance and upgradeability of the SIPLACE TX micron protect your investment. Two machines – one line The SIPLACE TX micron and the SIPLACE CA2 can be set up on the same production line, which brings several advantages for the manufacturer: Simpler intralogistics: there are no more separated solutions for die bonding and SMT placement solutions in production between which PCBs have to be transported back and forth Lower costs: no more taping for active components More environmentally friendly: less taping waste active components (from the wafer) and passive components (tape and reel) can be combined in one line, eliminates taping, splicing or refilling of the more expensive active components, meaning fewer errors possible Multi Purpose Dual Conveyor The Multi Purpose Dual Conveyor is an optional conveyor, which guarantees more flexibility and can be used for the following cases: More transport options and process flexibility with consistently high processing speed - even heavily bent heavier or thicker PCBs are no problem Maximum PCB thickness including warpage up to 13.5 mm Use of “thick” carriers (as often used for singulated substrates for Advanced Packaging processes) Use JEDEC trays as substrate carriers Use J-Boat carriers with high locating pins Max. PCB weight of up to 8 kg