Wafer inspection and sorting machine
CS 1250
Datacon
Sort to Tape Reel at up to 16'500 UPH - The high speed die sorter CS 1250 processes WLP and other flipped devices into tape and reel.
Pick, flip and place devices from wafer to tape reel with 4 point vision inspection process
Capable of handling devices from 0.3mm up to 10mm
Wafers up to 300mm diameter
Placement accuracy of ± 37μm @ 3 sigma
Post tape seal inspection
Tape width 8mm to 24mm
Placement accuracy of ± 37μm @ 3 sigma
Touch screen user interface
Real time wafer map display
Pressure sensitive (PSA) or heat activated (HAA) cover tapes
Automatic reject die management
Pick, flip and place devices from wafer to tape reel with 4 point vision inspection process
Capable of handling devices from 0.3mm up to 10mm
Wafers up to 300mm diameter
Placement accuracy of ± 37μm @ 3 sigma
Post tape seal inspection
Tape width 8mm to 24mm
Placement accuracy of ± 37μm @ 3 sigma
Touch screen user interface
Real time wafer map display
Pressure sensitive (PSA) or heat activated (HAA) cover tapes
Automatic reject die management
