The DXMC-500A is an electron beam PVD coating system for evaporative deposition of metals (including refractory metals) and selected oxides. It features a 270° deflecting electron beam, plasma glow-discharge cleaning and integrated process control for laboratory and light industrial production.
Main technical parameters- Vacuum chamber: SUS304 stainless steel, size Φ500 mm × H600 mm, front door with observation window to view electron gun and workpiece.
- Electron gun: one E-type 10 kW gun mounted at chamber bottom with pneumatic baffle; beam deflection angle 270°; six-hole water-cooled copper crucible (electrically transposable).
- Thermal evaporation: two rotating thermal evaporation sources (switchable); electronic gun evaporation source SEBG-103C (10 kW, 4-hole crucible).
- Vacuum system: turbomolecular pump FF-200/1200 (water-cooled) + 8 L/s mechanical pump; GV200 stainless-steel pneumatic main valve; DN40 corrugated metal pipelines; recovery to 5×10^-6 Torr ≤ 40 min; ultimate vacuum 5×10^-7 Torr.
- Vacuum control: molecular + mechanical pump unit with high-precision pneumatic flap valve and interlock protections; water, gas and phase-failure alarms included.
- Vacuum gauge: digital composite vacuum gauge ZDF-5227.
- Central control: Siemens PLC with touch screen for centralized control of vacuum, baking, rotation, evaporation, lighting and alarms.
- Fixture mechanism: rotating substrate holder for 4-inch or 6-inch substrates; rotation speed 0–10 rpm; film uniformity within effective coating area ≤ ±3% (6-inch specification).
- Film thickness control: quartz crystal thickness gauge interface; film thickness controller (domestic) with automatic rate and baffle control; gauge equipped with 2 probes.
- Baking: heating above substrate rack with digital temperature controller; max baking temperature 350 ℃.
- Cooling water for electron gun: flow ≥ 10 L/min; inlet pressure ≥ 0.15 MPa; inlet temperature ≤ 25 ℃.
- Additional: plasma glow-discharge cleaning rod; MFC gas mass flow controller D07-7 (1 circuit).
- Host and rack: host 1300 × 1200 × 1600 mm; equipment installation rack (profile steel bracket, sprayed panels); electric control cabinet 700 × 700 × 1760 mm.
Configuration list (from product table)- Vacuum chamber (Φ500 × H600 mm), front door, SUS304 stainless steel — Set — Qty: 1 — Manufacturer: DEXINMAG
- Observation window (installed on door, Φ100 mm) — EA — Qty: 2 — Manufacturer: DEXINMAG
- Observation window baffle (manual reversible dark glass) — Set — Qty: 2 — Manufacturer: DEXINMAG
- Lining anti-fouling plate (stainless steel) — Set — Qty: 2 — Manufacturer: DEXINMAG
- Louver baffle (prevents dust entering extraction line) — Set — Qty: 1 — Manufacturer: DEXINMAG
- Turbomolecular pump (FF-200/1200, water-cooled) — Set — Qty: 1 — Made in China
- Mechanical pump (8 L/s) — Set — Qty: 1 — Made in China
- Vacuum main valve (GV200, stainless steel) — Set — Qty: 1 — Manufacturer: DEXINMAG
- Pipeline (DN40 metal corrugated pipe) — Set — Qty: 2 — Manufacturer: DEXINMAG
- Angle valve (KF40) — EA — Qty: 2 — Manufacturer: DEXINMAG
- Digital composite vacuum gauge (ZDF-5227) — Set — Qty: 1 — Made in China
- Gas mass flow controller (D07-7) — Set — Qty: 1 — Made in China
- Substrate table (6-inch film uniformity ≤ ±3%) — Set — Qty: 1 — Manufacturer: DEXINMAG
- Thermal evaporation source (switchable) — Group — Qty: 2 — Manufacturer: DEXINMAG
- Electronic gun evaporation source (SEBG-103C, 10 kW, 4-hole crucible) — Set — Qty: 1 — Made in China
- Glow cleaning rod (with power supply) — Set — Qty: 1 — Made in China
- Equipment installation rack (profile steel bracket, sprayed) — Set — Qty: 1 — Manufacturer: DEXINMAG
- Film thickness gauge (2 probes) — Set — Qty: 1 — Made in China
- Main control power supply — Set — Qty: 1 — Manufacturer: DEXINMAG
Spare (consumable) parts- Crystals — pcs — Qty: 10 — Provided by DEXINMAG
- Electron gun filament — pcs — Qty: 10 — Provided by DEXINMAG
- Rubber ring 19×3.55 — pcs — Qty: 10 — Provided by DEXINMAG
- Window lead glass D117×10 — pcs — Qty: 2 — Provided by DEXINMAG
Installation site requirements- Cooling water for equipment: inlet temperature ≤ 20 ℃; inlet pressure ≥ 0.3 MPa; flow ≥ 2 m³/h.
- Instrument power: 380 V / 3-phase 5-wire, 50 Hz; phase imbalance ≤ 2%; total power ≥ 30 kW. Single-phase 220 V ± 10%. Neutral and earth conductor cross-section ≥ 10 mm².
- Compressed air: flow ≥ 0.8 m³/min; supply pressure ≥ 0.6 MPa.
- Gas cylinders: quantity and specifications to be determined by user per process; supply substrate, target material and working gas (e.g. high-purity argon).
- Equipment footprint: approx. 2 m × 3 m × 2.5 m (H).
Technical specifications- Chamber size: Φ500 mm × H600 mm.
- Ultimate vacuum: 5×10^-7 Torr; recovery to 5×10^-6 Torr ≤ 40 minutes.
- Electron gun: 10 kW; beam deflection 270°; six-hole water-cooled copper crucible.
- Thermal evaporation sources: 2 switchable sources; electronic gun SEBG-103C (10 kW, 4-hole).
- Pumping: turbomolecular FF-200/1200 (water-cooled) + mechanical pump 8 L/s; DN40 corrugated pipelines; GV200 stainless steel vacuum main valve.
- Film thickness control: quartz crystal gauge and controller; 2 probes; automatic evaporation rate and baffle control.
- Rotation: supports 4-inch or 6-inch substrates; rotation speed 0–10 rpm; uniformity ≤ ±3% (6-inch effective area).
- Baking: up to 350 ℃, digital temperature controller.
- Cooling water (gun): flow ≥ 10 L/min; inlet pressure ≥ 0.15 MPa; inlet temp ≤ 25 ℃.
- Control: Siemens PLC with touch screen; integrated vacuum, baking, rotation, evaporation, lighting and alarms.
- Host size: 1300 × 1200 × 1600 mm; electric control cabinet: 700 × 700 × 1760 mm.