- Industrial machines and equipment
- Surface Treatment Equipment
- Electronic vacuum coating machine
- Xiamen Dexing Magnet Tech. Co., Ltd.
Electron gun vacuum coating machine DXD-500for small batchesfor electronics
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Characteristics
- Options
- for electron guns, for small batches, for electronics
Description
Overview
Composition
Technical index
Technical specifications
- The DXD-500 Electron beam evaporation coating system is designed for preparation of electroconductive films, semiconductor films, ferroelectric films and optical thin films. Intended for scientific research and small-batch production in universities and research institutions.
Composition
- The system consists of the evaporation vacuum chamber, E-shaped electron gun(s), heating evaporation electrode, substrate heat revolution plate, working gas circuit, pumping system, vacuum measurement and electronic control system, installation fixtures and related accessories.
Technical index
- Model: DXD-500
- Structure: U-shape crate vacuum chamber with front door; pump system located at the rear.
- Vacuum chamber internal size: 500 × 500 × 600 mm3
- Configuration of vacuum system: compound molecular pump, mechanical pump, slide valve
- Ultimate pressure: ≤ 6.67×10^-5 Pa (after bake and degassing)
- Time of recovery vacuum: reaches 6.67×10^-4 Pa in 45 min (after short air exposure and injection of dry chlorine before pump-down)
- Electron beam evaporation source: E-shaped electron gun — positive pole voltage: 6 kV, 8 kV
- Evaporation source quantity: 2 electronic beam sources (sets)
- Crucible: water-cooled crucible, four-hole design; capacity each: 11 ml
- Electronic gun power: 0–6 kW adjustable
- Optional resistance evaporation source: voltage options 5 V, 10 V; current 300 A; max output power 3 kW; quantity: 1 set (configurable)
- Water cooling electrode: 3 pieces (arrangable into 2 evaporation boats)
- Substrate handling: accepts up to 4-inch substrates; max substrate temperature: 800 °C ± 1 °C; continuous rotation: 5–60 rpm; adjustable substrate-to-source distance: 300–350 mm; includes manual sample baffle (1 set)
- Air/gas circuit: mass flow controller — 1 channel
- Quartz crystal film thickness controller: monitor thickness display range: 0–99,999 Å (as provided)
- Floor space / mainframe footprint: 900 × 800 mm2
- Electric control cabinet footprint: 800 × 800 mm2 (2 sets)
Technical specifications
- Model: DXD-500
- Vacuum chamber internal size: 500 × 500 × 600 mm3
- Ultimate vacuum: ≤ 6.67×10^-5 Pa (after bake and degassing)
- Evaporation sources: 2 E-shaped electron beam guns (positive pole voltage 6 kV or 8 kV); optional resistance source (5/10 V, up to 3 kW)
- Evaporation power range (E-gun): 0–6 kW (adjustable)
- Substrate support: up to 4-inch substrates, continuous rotation 5–60 rpm, max substrate temp 800 °C ± 1 °C
- Substrate-to-source distance: adjustable 300–350 mm
- Pumping: compound molecular pump + mechanical pump with slide valve
- Control / monitoring: vacuum measurement and electronic control system; quartz crystal thickness monitor
- Footprint: mainframe 900 × 800 mm2; electric control cabinets 2 × (800 × 800 mm2)
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Vacuum Equipment
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