Magnetron sputtering machine DXJ-560D

The Pyriform Single-Chamber Magnetron Sputtering System DXJ-560D is a compact PVD system designed for preparation of a wide range of thin-film materials, including nanoscale mono- and multilayer multifunctional films (hard films, metal films, semiconductor films, dielectric films). It is intended for scientific research and small-batch preparation in universities and research institutions.

Composition

• The system mainly consists of the sputtering vacuum chamber, magnetron sputtering targets, substrate water-cooling heat-revolution plate, working gas circuit, pumping system, installation cabinet, vacuum measurement and electronic control system.

Technical index
See the full technical specifications below under "Characteristics / Technical specifications".

Characteristics / Technical specifications

• Model: DXJ-560D
• Sputtering vacuum chamber: Pyriform chamber, size Ø560 × 350 mm
• Vacuum system configuration: compound molecular pump, mechanical pump, slide valve
• Ultimate pressure: 2.0 × 10^-5 Pa (after bake and degassing)
• Time to recover vacuum: after exposure to air and dry chlorine inflation then pumping, system can reach 6.6 × 10^-4 Pa in 40 minutes
• Permanent magnetron sputtering targets: five permanent targets, size Ø60 mm (one target capable of sputtering magnetic material); RF and DC sputtering compatible; adjustable target-to-sample distance 40–80 mm
• Substrate water-cooling heat-revolution plate: 6 stations plus one position for heating furnace / water-cooling substrate plate
• Acceptable sample size: Ø30 mm (up to 6 pieces)
• Motion mode: 0–360° bi-directional rotation (front and back)
• Substrate heating: maximum temperature 600 ℃ ± 1 ℃
• Negative substrate bias: -200 V
• Air (gas) circuit system: 2-channel mass flow controller
• Computer control system: controls sample rotation, baffle switching and target position confirmation
• Floor space (mainframe): 1300 × 800 mm
• Electric control cabinet size: 700 × 700 mm (two sets)