Small batch vacuum coating machine DXMS-450C Magnetron Sputtering Coating System

for electron gunsfor electronics

Physical vapor deposition (PVD) equipment from Dexinmag enables transfer of atoms or molecules from a material source to the substrate surface using physical processes (evaporation, sputtering, ion beam, etc.), for the preparation of thin films and nano/micro-structured coatings.

Advantages of PVD coating

• Simple - no chemical reactions involved, only physical transfer of atoms/molecules.
• Controllable - deposition rate and film thickness can be controlled by temperature, angle, distance, power and other parameters.
• Safe - no toxic, harmful, flammable or explosive gases required during coating.

Product categories

• Magnetron sputtering coating system
• Laser coating equipment
• Evaporation coating equipment
• Electron beam evaporation / coating systems

Case 1: DXMS-450C Magnetron Sputtering Coating System

• Pear-shaped sputtering coating chamber, 1 set; chamber size: Φ450 mm × 460 mm (H); electric large flange cover on chamber.
• Two Φ4-inch magnetron sputtering target interfaces on base plate with adjustable target head; compatible with RF and DC; water-cooled; single or double target sputtering.
• CF150 flange interface for vacuum system and vacuum measurement interface; two observation windows with baffles.
• Vacuum acquisition & measurement: FF620 turbomolecular pump + 8 L/s mechanical pump; ultimate vacuum better than 8×10⁻⁵ Pa; domestic digital composite vacuum gauge; GV150 manual gate valve on molecular pump port.
• Sample holder assembly: substrate table Φ150 mm (fits 2–6-inch substrates or multiple small substrates); maximum heating temperature ≥ 500 ℃; substrate rotation 2–10 rpm (controllable); 1 set of sample baffle; heater made of oxidizable material; Japanese-brand temperature controller selected; negative bias voltage 0–200 V.
• Magnetron sputtering targets: two Φ4-inch targets installed on bottom plate; coating uniformity: within 5-inch effective area ≤ ±5%, within 2-inch effective area ≤ ±3%.
• Inflation gas path: three intake gas paths with mass flow controllers for argon and oxygen control, plus one nitrogen path; three channels enter the coating chamber through one CF16 ultra-high vacuum shut-off valve.
• Coating power supplies: one RF power supply 500 W (automatic matching), one DC power supply 1000 W.
• Frame / rack and system control: 380 V / 50 Hz three-phase five-wire power supply with leakage protection and equipment grounding; two international standard power cabinets housing main control power, digital composite vacuum gauge, sample rack heating temperature controller, sample rack drive, chamber lighting, molecular pump power, RF and DC coating power supplies.

Case 2: DXMC-500A Electron Beam Coating System

• Purpose: coating of metals (especially refractory metals) and some oxides using a 270° electron beam to heat and evaporate source materials; equipped with a glow-discharge cleaning rod for plasma cleaning.
• Vacuum chamber: SUS304 stainless steel, size Φ500 mm × 600 mm (H); front door with observation window to view electron gun and workpiece.
• Electron gun: one e-type 10 kW electronic gun with pneumatic baffle at chamber bottom; electron beam deflection angle 270°; six-hole water-cooled copper crucible (electrically transposable); automatic high-voltage arc extinguishing reset for gun power supply.
• Vacuum system (turbo + mechanical): one FF-200/1200 turbomolecular pump, one GV200 pneumatic flap valve, one 8 L/s mechanical pump, Dg40 solenoid valves; digital display composite vacuum gauge; ultimate vacuum ~5×10⁻⁷ Torr. Recovery time: atmosphere → 5×10⁻⁶ Torr ≤ 40 min. Vacuum control includes interlock protections and alarms (water, gas, phase failure).
• Fixture mechanism: rotating frame above chamber holds 4-inch or 6-inch substrates; uniformity within effective coating area ≤ ±3%; fixture speed 0–10 rpm.
• Baking & thickness control: internal baking above workpiece rack (max 350 ℃) with digital temperature controller; quartz crystal film thickness gauge (controller) to automatically control evaporation rate and baffle action.
• Additional configuration: two sets of thermal evaporation sources (rotating operation), one high-pressure plasma cleaning rod, MFC mass flow meter (1 circuit), rack (host size ~1300×1200×1600 mm), electric control cabinet (~700×700×1760 mm), cooling water requirement for gun: flow ≥ 10 L/min, pressure ≥ 0.15 MPa, inlet temp ≤ 25 ℃.

Caractéristiques / spécifications techniques

• Types of PVD processes covered: magnetron sputtering, laser coating, thermal evaporation, electron beam evaporation/evaporation coating.
• DXMS-450C chamber size: Φ450 mm × 460 mm (H); two Φ4" magnetron targets; substrate table Φ150 mm; substrate heating ≥ 500 ℃; substrate rotation 2–10 rpm; coating uniformity ≤ ±5% (5" area) and ≤ ±3% (2" area); vacuum: turbomolecular + 8 L/s mechanical pump; ultimate vacuum < 8×10⁻⁵ Pa.
• DXMS-450C coating power: RF 500 W (auto-matching) and DC 1000 W.
• DXMC-500A chamber size: Φ500 mm × 600 mm (H); electron gun: 10 kW, 270° deflection; two thermal evaporation sources; ultimate vacuum ~5×10⁻⁷ Torr (turbo + mechanical); recovery time atmosphere → 5×10⁻⁶ Torr ≤ 40 min; fixture speed 0–10 rpm; baking max 350 ℃.
• Gas handling: multichannel MFCs for Ar/O₂ control and N₂ path; CF150 / CF16 flange interfaces for vacuum and gas connections.
• Controls & safety: centralized Siemens PLC + touch screen for vacuum/ baking/rotation/evaporation control, interlock protections, alarms; power supply: 380 V / 50 Hz three-phase with leakage protection; power cabinets include vacuum gauge, heating controllers, drive power, pump power and coating power supplies.
• Typical applications: preparation of metal, semiconductor, dielectric, oxide, nitride, superconducting films, ferroelectric films, superhard films and other nano / micro thin film materials for research and small-batch production.