Magnetron sputtering machine DXJ-1000

for metallization

DXJ-1000 is a square four-chamber magnetron sputtering system designed for deposition of metal films (Al, Ag, Ni, Cu, Ti, Pd and others) on crystalline silicon substrates. It supports reactive sputtering and full magnetron coating processes under high and low vacuum and is suitable for continuous production of large-area crystalline silicon photovoltaic cell films in various specifications.

Composition

• The system mainly consists of: sample injection chamber, sputtering chamber, sample making chamber, substrate delivery mechanism, pumping and vacuum measurement system, gas circuit system, electronic control system, ion gun cleaning and automatic control.

Technical index

• Model: DXJ-1000
• Main sputtering vacuum chamber: square, 1000×700×350 mm
• Sample injection chamber: square, 700×700×350 mm
• Vacuum system configuration: mechanical pump + molecular pump + slide valve
• Ultimate pressure:
  • Main sputtering chamber: ≤8×10⁻5 Pa (after bake and degassing)
  • Sample injection chamber: ≤6.6×10⁻4 Pa (after bake and degassing)
• Vacuum recovery time:
  • Main sputtering chamber: reach 6.6×10⁻4 Pa in ~40 min (after short air exposure and dry purge)
  • Sample injection chamber: reach 5×10⁻3 Pa in ~20 min (after short air exposure and dry purge)
• Permanent magnetron targets: two square magnetron targets (~450×75 mm); target-to-sample distance ≈80 mm
• Substrate heat plate:
  • Supported substrate sizes: 125×125 mm or 156×156 mm (4 pieces per load)
  • Heating temperature: room temperature up to ~400°C (±2°C), controllable
• Other configuration: equipped with ion gun cleaning and automatic control
• Gas circuit system: mass flow controllers, 3 channels
• Floor space:
  • Mainframe footprint: 2655×930 mm²
  • Electric control cabinets: 2 × 700×700 mm²

Technical specifications

• Model: DXJ-1000
• Main chamber: 1000×700×350 mm
• Sample injection chamber: 700×700×350 mm
• Vacuum: mechanical pump + molecular pump + slide valve; ultimate pressure ≤8×10⁻5 Pa (main chamber)
• Recovery times: main chamber to 6.6×10⁻4 Pa in ~40 min; sample chamber to 5×10⁻3 Pa in ~20 min
• Magnetron targets: two square targets (~450×75 mm), target-to-sample ≈80 mm
• Substrate plates: supports 125×125 mm or 156×156 mm (4 pieces); heating up to ~400°C (±2°C), adjustable
• Additional: ion gun cleaning, automatic control; 3-channel mass flow controllers
• Footprint: mainframe 2655×930 mm²; electrical cabinets: two sets 700×700 mm²