OverviewMagnetron sputtering system is a PVD coating system for preparing a wide range of thin-film materials, including nanoscale mono- and multilayer multifunctional films, hard coatings, metal, semiconductor and dielectric films. Suitable for thin-film materials research and small-batch production in universities and research institutes.
Main components- Sputtering vacuum chamber: cylindrical front-opening door, size Ø450×400 mm
- Permanent magnetron sputtering targets: three permanent targets; target diameter Ø60 mm (one target supports magnetic materials)
- Single-zone heater (max 600°C ±1°C)
- DC power supply and RF power supply
- Working gas circuit with 2-channel mass flow control
- Pumping system: compound molecular pump + mechanical pump; pneumatic slide valve; imported SMC cylinder throttle
- Vacuum measurement and electronic control: PLC + industrial PC + touch screen
Technical specifications- Ultimate pressure: ≤6.6×10^-6 Pa (after baking and degassing)
- Vacuum recovery time: 25 min to reach 6.6×10^-4 Pa (after air exposure and dry purging)
- Target compatibility: DC and RF sputtering; in-target water cooling
- Target arrangement: three targets can be angled to above the sample center simultaneously; adjustable target-to-sample distance 90–130 mm
- Rotary shutter: each target equipped with imported SMC rotating pneumatic baffle
- Sample size: Ø4 inches
- Substrate motion: continuous rotation, speed 0–30 rpm
- Gas control: imported SMC corner cylinder control; quality flow controller, 2-channel
- Computer control: PLC + Industrial PC + touch screen automatic control
Applications- Thin-film material research, R&D in universities and research institutes
- Small-batch preparation of nanoscale mono- and multilayer films, functional coatings and semiconductor films
Options & footprint- Optional accessories: film thickness monitor, additional pumps, cooling water recirculation unit
- Floor space: mainframe 1.0 m × 1.8 m; electrical control cabinet 0.9 m × 0.6 m