Laser cladding for the microelectronics industry DXP-450B

Overview

DXP-450B Laser Coating Equipment is engineered for the preparation of superconducting thin films, semiconductor films, ferroelectric films and related thin-film materials. It is intended for thin-film research and small-batch fabrication at universities, research institutes and R&D laboratories.

Composition

• Sputtering vacuum chamber (spherical)
• Rotating target platform (multi-target)
• Antioxidative substrate heat plate
• Working gas circuit and purge/bleed system
• Installation/assembly fixture
• Vacuum measurement and monitoring system
• Electrical control cabinet and control electronics
• Auxiliary components and interfaces

Technical data

• Model: DXP-450B
• Main vacuum chamber: spherical, Ø450 mm
• Vacuum system configuration: mechanical pump + molecular pump
• Ultimate pressure: ≤ 6.67×10⁻⁶ Pa (after bake and degassing)
• Vacuum recovery: reaches 5×10⁻³ Pa within ~20 min (after brief air exposure, dry purge and pump-down)
• Rotating target platform: target diameter Ø60 mm or Ø25 mm; up to 4 targets mounted; independent target revolution and rotation control; speed 5–60 rpm
• Substrate heat plate — sample size: 2 inches
• Substrate heat plate — motion mode: continuous sample rotation; speed 5–60 rpm
• Substrate heating: max temperature 800℃ ±1℃
• Gas control: 1-channel mass flow controller
• Laser beam scanning: two-dimensional scanning mechanical stage (free two-axis scanning)
• Computer control: integrated control of target platform, target rotation, sample rotation, temperature and laser scanning
• Footprint — mainframe: 1500 × 900 mm²
• Footprint — electric control cabinet: 700 × 700 mm² (1 set)

Key specifications

• Chamber geometry: spherical Ø450 mm
• Vacuum pumps: mechanical + molecular pump
• Ultimate vacuum: ≤ 6.67×10⁻⁶ Pa (post bake/degassing)
• Recovery to 5×10⁻³ Pa: ~20 min (standard procedure)
• Target options: Ø60 mm or Ø25 mm, up to 4 targets, 5–60 rpm
• Sample handling: 2-inch samples, continuous rotation 5–60 rpm
• Substrate temperature control: up to 800℃ ±1℃
• Gas feed: single-channel mass flow control
• Laser scanning: 2D mechanical scanning stage
• System control: PC-based integrated control
• Footprint: mainframe 1500×900 mm²; control cabinet 700×700 mm²

Typical applications

• Research and development of superconducting, semiconductor and ferroelectric thin films
• Small-batch sample preparation and prototype production
• Material studies requiring precise substrate heating and controlled vacuum/gas environments
• Laboratory-scale thin-film deposition and laser-assisted coating experiments