Automated sub-micron die bonder platform
FINEPLACER® femto
Finetech
Fully-automated sub-micron bonder FINEPLACER® femto has been designed for advanced packaging and optoelectronic applications.
This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.
Highlights
- Placement accuracy better than 0.5 µm
- Component sizes from 0,07² mm² to 100² mm²*
- Working area up to 450 mm x 150 mm*
- Supports wafer/substrate sizes* up to 12"
- Supports bonding forces up to 500 N*
- Wide range precision positioning stage
- Universal fixture for simplified and economical tool handling
- Small footprint and compact design
- Best cost-performasnce-ration in the market
* depending on configuration
Features & Benefits
- User-independent automated processes
- Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
- Integrated Process Management (IPM)
- Adaptive process library
- Live process observation camera
- ROI savings - one machine for all applications
Technologies
- Thermocompression
- Thermo/Ultrasonic
- AuSn, C4, Indium, eutectic soldering
- Adhesive technologies
- Curing (UV, thermal)
- Mechanical assembly
This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.
Highlights
- Placement accuracy better than 0.5 µm
- Component sizes from 0,07² mm² to 100² mm²*
- Working area up to 450 mm x 150 mm*
- Supports wafer/substrate sizes* up to 12"
- Supports bonding forces up to 500 N*
- Wide range precision positioning stage
- Universal fixture for simplified and economical tool handling
- Small footprint and compact design
- Best cost-performasnce-ration in the market
* depending on configuration
Features & Benefits
- User-independent automated processes
- Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
- Integrated Process Management (IPM)
- Adaptive process library
- Live process observation camera
- ROI savings - one machine for all applications
Technologies
- Thermocompression
- Thermo/Ultrasonic
- AuSn, C4, Indium, eutectic soldering
- Adhesive technologies
- Curing (UV, thermal)
- Mechanical assembly
