|
|
Designed for 300mm wafer processing, the Despatch AST-1100 also accommodates 200mm wafers. This automated photoresist bake tool increases throughput and eliminates handling errors while conserving valuable floor space.
Thermal Data - The Despatch AST-1100 Automated Photoresist Bake Tool provides tight temperature uniformity. The tool maintains uniformity of +/-1.0°C within each wafer and throughout all 25 wafers in the thermal chamber at soak.
Increase Throughput, Eliminate Errors, and Improve Ergonomics - Utilizing Despatch's automated wafer handling system will eliminate costly errors, improve ergonomics, and boost throughput. This process eliminates manual handling of 300mm wafers that exceed the weight limit for repetitive human handling, set by OSHA. The oven's two chambers each hold up to 25 wafers during the process cycle. Despatch can add additional heat chambers to increase throughput.
Conserve Valuable Clean Room Space - The Despatch 300mm oven measures approximately 103 inches (262 cm) wide by 88 inches (224 cm) long. Its small footprint will minimize clean room space needed and maximize your production environment. Compatible with either ballroom or bulkhead mounted installations.
|
|
For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
|
|
|
HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
|
|
|
is designed for fully automatic, precision microelectronics assembly and performs adhesive dispense, pick and place component placement, eutectic die attach, and flip chip operations. This versatile machine is well suited for a high mix, low volume production environment, and can easily be configured for high volume production by adding automated handling capabilities.
|
|
Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
|
|
|
The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
|
|
| ... products without technical information |
| |
|
|
