|
|
Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
|
|
|
HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
|
|
The FC300 High Force Device Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding on wafer up to 300 mm.
It includes Nanoimprinting Lithography (NIL) capabilities.
The FC300 is a configurable platform which can perform various applications with a quick and easy process head exchange:
high force bonding, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography,
low force for reflow bonding of RF & optoelectronics devices assembly,
UV-curing for adhesive bonding or for Nanoimprint using the UV-NIL process.
High End Processes
Die bonding, flip chip bonding, mass reflow, in-situ reflow, fluxless eutectic bonding, thermocompression bonding, ultrasonic bonding, UV-curing bonding, adhesive bonding,
UV-NIL, hot embossing lithography...
|
|
For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
|
|
An accurate high-speed flip chip bonder, the FCB3 accommodates a variety of needs. From development to pre-production and multiple-model production, this machine offers outstanding functionality.
The FCB3 features a simultaneous recognition camera that ensures accurate bonding in continuous production. Additionally, the automatic calibration function corrects thermal changes over time, guaranteeing bonding accuracy of ± 3 _m/3 sigma during continuous production.
Ideal for medium to very fine pitch manufacturing.
Features & Benefits
Flexible modular system accommodates various processes
IC feed from both tray and wafer optimizes productivity
Automatic tool changer with 4 input handles up to 38 types of ICs
Wide component range - from 2" x 2" (up to 320 inputs) to 4" x 4" (up to 80 inputs)
|
|
KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding
|
|
|
The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
|
|
| ... products without technical information |
| |
|
|
