Pico-ITX / 2.5" motherboard QCS051
Qualcomm® QCM6490Qualcomm® QCS5430Intel®

Pico-ITX / 2.5" motherboard - QCS051 - DFI - Qualcomm® QCM6490 / Qualcomm® QCS5430 / Intel®
Pico-ITX / 2.5" motherboard - QCS051 - DFI - Qualcomm® QCM6490 / Qualcomm® QCS5430 / Intel®
Pico-ITX / 2.5" motherboard - QCS051 - DFI - Qualcomm® QCM6490 / Qualcomm® QCS5430 / Intel® - image - 2
Pico-ITX / 2.5" motherboard - QCS051 - DFI - Qualcomm® QCM6490 / Qualcomm® QCS5430 / Intel® - image - 3
Pico-ITX / 2.5" motherboard - QCS051 - DFI - Qualcomm® QCM6490 / Qualcomm® QCS5430 / Intel® - image - 4
Pico-ITX / 2.5" motherboard - QCS051 - DFI - Qualcomm® QCM6490 / Qualcomm® QCS5430 / Intel® - image - 5
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Characteristics

Format
Pico-ITX / 2.5"
Processor
Qualcomm® QCM6490, Qualcomm® QCS5430
Chipset
Intel®
Memory
LPDDR5
Extension slot
M.2 Key E, M.2 Key B, nano SIM
Applications
industrial, network
Operating system
Linux, Yocto, Android
Connectivity
RS232, USB 2.0, USB 3.1, CAN Bus, HDMI, RJ45, GbE

Description

Product Overview
  • Qualcomm QCS6490 high-level platform
  • Target on AMR, box PC application
  • Thin client concept and ruggedize
  • 2 M.2 Expansions: 1 M.2 E key 2230, 1 M.2 B key 3052

Features
  • Fanless Design
  • Display: 1 x HDMI Type A, w/o audio. 1080P support on Linux
  • M.2 Expansions: 1 x M.2 B key 3052 (USB 3.1/Opt. USB 2.0), 1 x M.2 E key 2230 (PCIe x1)
  • Ruggedized for industrial environments
  • LPDDR5x memory up to 8GB
  • AMR (Autonomous Mobile Robot) application ready

Certifications
  • RoHS Certification
  • CE Certification
  • FCC Certification
  • UKCA Certification

Product Details
  • QCS051 is a reliable and efficient 2.5" SBC suitable for industrial and AI applications. Powered by the Qualcomm® QCS6490 SoC, this Single-board Computer includes 8 cores that can achieve speeds up to 2.7 GHz. Such performance guarantees continuous interaction with the device even in the most challenging industrial surroundings. QCS051 is one of the most powerful SBCs thanks to its inclusion of the QCS6490’s AI Engine, edging it at a remarkable 12 TOPS. This makes it the ideal option for applications that require minimal to advanced learning capability with AI functionality, making it highly effective in numerous situations. Furthermore, the integrated Qualcomm® Adreno™ 643L GPU hones and refines the graphic query to support visual-dependent applications.
  • QCS051 combines powerful LPDDR5x memory modules that support up to 8GB capacity. This enables it to run at 7,500MT/s, with a greatly enhanced TX/RX signal performance, resulting in an overall 36% bandwidth increase. Such features are far beyond those of competitors that still rely on the DDR4 platform. DFI is clearly ahead thanks to the revolutionary memory technology integrated in our QCS051 solution.
  • QCS051 2.5"SBC supplies adaptable connectivity in limited space. Its two M.2 expansion slots support E-key and B-key modules for wireless communication. Additionally, it supports 2 x MIPI-CSI for high-resolution cameras, 1 x RS-232, 4 x USB 2.0 (UBJ1/2/4/5, 1x4P/1.25mm), with UBJ4 optionally convertible to M.2 B key. Other interfaces include 1 x USB Type C, 1 x 8-bit DIO, 1 x uSD3.0 card slot, 1 x CAN FD, 1 x Ext. IO (1*12P/1.25mm), 1 x Power LED, 1 x System LED, 1 x Front Panel connector, 1 x Fan connector, 2 x USB 3.1 Gen1 Type A, 1 x Line out/Mic in audio jack, 1 x HDMI 1.4, 1 x Micro USB debug UART, and 1 x GbE (RJ-45).
  • Thanks to Qualcomm QCS6490 SoC, this 2.5"SBC excels in confined spaces and demanding environments. Equipped with flexible expandability and I/O versatility, including 5G connectivity via a M.2 B key 3052 with Nano SIM Slot, M.2 E key 2230 offers Wi-Fi6E module compatibility. There is also a GbE high-speed wired network option for ruggedized environments requiring AI performance under a wide temperature range of -25°C to 75°C. It even supports OS like Ubuntu, Android, and Windows.

Technical Specifications
  • Processor: QCS6490: Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8); QCS5430 (FP1): Qualcomm® Kryo™ 670, 6 cores, up to 2.1 GHz, 3.5 TOPS (INT8)
  • Memory: LPDDR5x, 4/8GB
  • Graphics: Qualcomm® Adreno™ 643L GPU; OpenGL ES 3.2
  • Display: 1 x HDMI Type A, w/o audio. 1080P support on Linux; Single Display: HDMI
  • Storage: Support UFS 3.1, default 128GB
  • Expansion: 1 x M.2 B key 3052 (USB 3.1/Opt. USB 2.0), 1 x Nano SIM slot, 1 x M.2 E key 2230 (PCIe x1)
  • Audio: Audio codec WCD9385
  • Ethernet: AX88179A USB3 to GbE controller; 1 x GbE (RJ-45)
  • Rear I/O: 2 x USB 3.1 Gen1 Type A, 1 x HDMI 1.4, 1 x Line out/Mic in audio jack, 1 x Micro USB debug UART
  • Internal I/O: 1 x RS-232 (COM1), 3 x USB 2.0, 1 x USB Type C (Download only), 1 x 8-bit DIO, 1 x uSD3.0 card, 1 x CAN FD, 1 x Ext. IO, 1 x Power LED, 1 x System LED, 1 x Front Panel, 1 x Fan connector (upon request), 2 x MIPI-CSI2 for 4-lanes camera
  • Power: 5VDC, 2 pin Power Jack; Typical: QCS6490: 5V @ 0.6A (3.0Watt); Max.: QCS6490: 5V @ 1.45A (7.25Watt); RTC Battery: CR2032 Coin Cell
  • OS Support: Default: Yocto (Linux Kernel 6.6.x); Upon request: Ubuntu 20.04 (Linux Kernel 5.4.x)
  • Environment: Operating: 0°C~60°C, -25°C~75°C; Storage: -40°C~85°C; Humidity: Operating: 5%~90% RH; Storage: 5%~90% RH
  • Mechanism: 2.5" Pico-ITX Form Factor; 100mm x 72mm; PCB: 1 mm; Top Side: 16.44 mm; Bottom Side: 3.45 mm
  • Certifications: CE, FCC, RoHS, UKCA
  • Packing List: 1 QCS051 board, Heat spreader (Height: 7mm) A71-808357-000G
  • Country of Origin: Taiwan

Ordering Information
Model Name: QCS051-BCC-4890, Part Number: 770-QCS0511-000G, Description: Qualcomm® QCS6490, LPDDR5x 4GB, 128GB UFS 3.1, HDMI, 1 GbE, 2 USB 3.1 Gen1, 3 USB 2.0, 1 RS-232, 5VDC Power, Fanless, 0 to 60°C
Model Name: QCS051-ECC-8890, Part Number: 770-QCS0511-100G, Description: Qualcomm® QCS6490, LPDDR5x 8GB, 128GB UFS 3.1, HDMI, 1 GbE, 2 USB 3.1 Gen1, 3 USB 2.0, 1 RS-232, 5VDC Power, Fanless, -25 to 75°C
Model Name: QCS051-BCC-4830, Part Number: 770-QCS0511-300G, Description: Qualcomm® QCS5430, LPDDR5x 4GB, 128GB UFS 3.1, HDMI, 1 GbE, 2 USB 3.1 Gen1, 3 USB 2.0, 1 RS-232, 5VDC Power, Fanless, 0 to 60°C

Optional Items
  • Heat sink for 0 to 60°C/-25 to 75°C, Part Number: A71-008191-010G, Height: 17.1mm
  • USB 2.0 port cable, Part Number: A81-001188-018G, Length: 100mm
  • COM port cable, Part Number: A81-015121-018G, Length: 200mm
  • CAN Bus cable, Part Number: A81-015122-018G, Length: 150mm
  • 2 pole to DC Jack power cable, Part Number: A81-004381-018G, Length: 150mm
  • Front panel cable, Part Number: A81-006104-018G, Length: 150mm
  • Power adapter, Part Number: 671-103002-000G, 30W, 5V, DC Jack

Tags
  • Edge AI Computing
  • M.2
  • LPDDR5x
  • Qualcomm® QCS6490
  • AI
  • Qualcomm®
  • SIM Slot
  • CAN-Bus
  • Fanless Design
  • Compact Size
  • Linux
  • RoHS Certification
  • CE Certification
  • FCC Certification
  • AMR
  • UKCA Certification

Technical Characteristics / Specifications
  • Processor: Qualcomm® QCS6490 / QCS5430
  • Memory: LPDDR5x, 4/8GB
  • Storage: UFS 3.1, default 128GB
  • Display: 1 x HDMI Type A, 1080P support on Linux
  • Expansion: 1 x M.2 B key 3052, 1 x M.2 E key 2230, 1 x Nano SIM slot
  • Ethernet: 1 x GbE (RJ-45)
  • USB: 2 x USB 3.1 Gen1 Type A, 3 x USB 2.0, 1 x USB Type C, 1 x Micro USB debug UART
  • Serial: 1 x RS-232 (COM1)
  • Audio: 1 x Line out/Mic in audio jack, Audio codec WCD9385
  • Camera: 2 x MIPI-CSI2 for 4-lanes camera
  • Power: 5VDC, 2 pin Power Jack, RTC Battery: CR2032 Coin Cell
  • Operating Temperature: 0°C~60°C, -25°C~75°C
  • Storage Temperature: -40°C~85°C
  • Humidity: 5%~90% RH
  • Dimensions: 100mm x 72mm (2.5" Pico-ITX Form Factor)
  • Certifications: CE, FCC, RoHS, UKCA
  • Country of Origin: Taiwan

Exhibitions

Meet this supplier at the following exhibition(s):

InnoTrans 2026
InnoTrans 2026

22-25 Sep 2026 Berlin (Germany) Hall 6.1 - Stand 545

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