3.5" SBC M8MP553

dual-corequad-coreNXP i.MX8M Plus

Product Overview

• ARM® i.Mx8M plus-based Processor for 30% performance enhancement
• Industry-Leading Wide Voltage Support 9 to 36V
• Ultra-High-Speed Connectivity for 4G/5G Edge Gateway
• Outstanding Graphic Performance, supports LVDS and HDMI with dual display
• CAN bus for automation equipment integration
• 1 M.2 2230 E key, 1 3052 B key

Empowering Machine Learning at the Edge
With a 3.5” form factor SBC iMx8M plus-based solution, M8MP553 is powered by dual-core to quad-core 64bit 1.8GHz Arm® Cortex-A53 processor for real-time tasks, improving overall performance by 30% compared to the previous generation.

Unparalleled Performance with ARM® i.Mx8M plus Processors
With Built-in low-power processors, M8MP553 is designed for complex computing tasks and delivers superior image and AI inferencing capabilities. It empowers the industrial edge with low latency, power efficiency, and advanced precision. M8MP553 is applicable to meet the needs of intelligent applications, including object recognition and detection for Industrial Automation, Medical, and Smart City Infrastructure.

Superior Visual Capability
I.Mx8M plus processor is integrated with neural network processing unit (NPU). It is designed from the ground up to execute deep learning inference, and to outperform CPU- and GPU-based solutions in the same power range by several times. The NPU embedded in the I.MX8M plus helps users who need AI functions to add value to their industrial robotics or in-vehicle application. It enhances M8MP553 with superior multimedia capabilities, including video encoding and decoding, 2D/3D graphic acceleration, and multiple audio and voice functionalities.

Flexible I/O Tailored Fast Computing at the Edge
M8MP553 solution delivers a richer I/O, multiple interfaces, and performance enhancement with cost-efficiency simultaneously. Along with other expansion interfaces designed for high-end flaw detection and imaging, M8MP553 provides great flexibility and scalability for Edge AI applications.

Ultra-High-Speed Connectivity for Edge AI
For high precision computing devices for flaw detection and machine vision, the 4G/5G edge gateway can quickly handle the transmission of high-resolution images, accelerating M2M communication.

Outstanding Graphic Performance
M8MP553, equipped with an iM8M plus processor, delivers advanced 4K performance. It supports LVDS and HDMI with dual display visuals for applications such as facial recognition, object detection, machine vision, and digital signage.

Industry-Leading Wide Voltage and Temperature Endurance
M8MP553 supports 9-36V ultra-wide voltage to provide operational stability. In addition, with an advanced wide operating temperature ranges from -30°C to 80°C, M8MP553 satisfies the need of industries in harsh environment and outdoor applications, especially for smart city infrastructure, industrial automation, and charging station applications.

Industrial-Grade Long Term Support
Long life cycle support, no risk occurred. With product life support up to 15 years, DFI guarantees performance, quality, and future repair and replacement.

Technical Specifications

• Processor: i.MX 8M plus applications processors
  MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz, VPU/ISP/CAN FD, -40~105°C
  MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz, VPU/ML/ISP/CAN FD, -40~105°C
• Memory: 2GB/4GB/8GB LPDDR4 Memory Down
• Graphics Controller: GC7000UL
• Graphics Features: HW Decode: 1080p60 H.265, H.264, VP9, VP8; HW Encode: 1080p60 H.265, H.264
• Display: 1 x HDMI, 1 x LVDS; HDMI: up to 1920x1080 @60Hz; LVDS: up to 1920x1200 @60Hz
• Dual Displays: LVDS + HDMI (Android: support single output)
• Storage: 1 x eMMC 5.1 with default 16GB (up to 64GB)
• Expansion: 1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0), 1 x M.2 E key 2230 (PCIe x1/USB 2.0), 1 x Nano SIM slot
• Audio Codec: SGTL5000
• Ethernet PHY: AR8035
• Rear I/O: 2 x GbE (RJ-45), 1 x RS485 (2-wire), 2 x USB 3.1 Gen1, 2 x USB 2.0, 1 x HDMI
• Internal I/O: 1 x RS232, 1 x RS232/422/485 (2.0mm pitch), 2 x USB 2.0 (2.00mm pitch, 2nd USB opt. from M.2 3052), 1 x Micro USB OTG, 1 x LVDS LCD Panel connector, 1 x LCD/Intverter Power, 1 x Audio (Line-out/Mic-in), 1 x 8-bit DIO, 1 x uSD card, 2 x CAN bus 2.0b (on Industrial CPU sku), 1 x I2C / Touch
• Watchdog Timer: System Reset, Programmable via Software from 1 to 255 Seconds
• Power: Wide Range 9~36VDC; Note1: Support 9V~24VDC in -30~80°C operating temperature; Note2: Support 36VDC within 70°C operating temperature; 2-pole terminal block (default), Co-lay 4-pin vertical power connector; Typical: i.MX 8M Plus Quad, 12V, 3.6Watt; Max.: i.MX 8M Plus Quad, 12V, 5.28Watt; Battery: CR2032 Coin Cell
• OS Support: Linux Yocto 5.0 (default), Debian 12 (upon request), Android 10 (upon request)
• Environment: Operating: -30 to 80 °C; Storage: -40 to 85°C; Operating Humidity: 5 to 90% RH; Storage Humidity: 5 to 90% RH; MTBF (i.MX 8M Plus Quad): 632,710 hrs @ 25°C; 386,370 hrs @ 45°C; 252,204 hrs @ 60°C; 138,544 hrs @ 80°C (Telcordia Issue 4, GB, GC – Ground Benign, Controlled)
• Mechanism: 3.5" SBC Form Factor; 146mm (5.75") x 102mm (4.02"); PCB: 1.6mm; Top Side: 15mm; Bottom Side: 4mm
• Certifications: CE, FCC, RoHS, UKCA
• Packing List: 1 M8MP553 board, 1 Terminal block for RS485 (COM3) 342-361021-000G, 1 Heatsink (Height: 21mm) A71-008168-000G
• Country of Origin: Taiwan

Ordering Information

• M8MP553-ECC-41QDI: Quad Core Processor, 4 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -30 to 80°C
• M8MP553-ECC-21DLI: Dual Core Processor, 2 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -30 to 80°C
• M8MP553-ECC-81QDI: Quad core Processor, 8 GB Memory Down, eMMC 16 GB, 2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0, Power 9~36VDC, fanless design, -30 to 80°C

Optional Items

• 2 pole terminal to DC jack cable (A81-004013-000G)
• Power adapter 60W, 12V, DC Jack (671-106012-000G)
• USB 2.0 cable, Length: 200mm (A81-001032-016G)
• COM port cable, Length: 250mm, COM1/4 (A81-009595-016G)
• Audio, Length: 300mm (A81-022031-016G)
• Heat spreader, Height: 11mm (A71-808351-000G)
• Debug console with cable, Length: 500mm (770-IMX8M1-000G)

Tags

• Edge AI Computing
• NXP
• IoT
• 5G
• ARM
• Fanless Design
• Compact Size
• 4K2K Display
• Linux
• Android
• Multiple Expansion
• DDR4
• Low Power Consumption
• RoHS Certification
• CE Certification
• FCC Certification
• UKCA Certification
• NXP i.MX 8M

Key Features / Technical Specifications

• Processor: i.MX 8M Plus, Quad/Dual Core, up to 1.8GHz
• Memory: 2GB/4GB/8GB LPDDR4
• Storage: eMMC 16GB (up to 64GB), 1 x uSD card
• Display: 1 x HDMI, 1 x LVDS, Dual display support
• Ethernet: 2 x GbE (RJ-45)
• USB: 2 x USB 3.1 Gen1, 4 x USB 2.0, 1 x Micro USB OTG
• Serial: 1 x RS485, 1 x RS232, 1 x RS232/422/485
• Expansion: 1 x M.2 B key, 1 x M.2 E key, 1 x Nano SIM slot
• CAN bus: 2 x CAN bus 2.0b
• Audio: SGTL5000 codec, 1 x Audio (Line-out/Mic-in)
• Power: 9~36VDC, Typical 3.6W, Max 5.28W
• Operating Temp: -30°C to 80°C
• Certifications: CE, FCC, RoHS, UKCA
• OS Support: Linux Yocto 5.0, Debian 12, Android 10
• Dimensions: 146mm x 102mm (3.5" SBC)
• Country of Origin: Taiwan