Regulated DC/DC converter ZVS

non-isolatedSIPfor telecommunications equipment

Product overview

• Family: ZVS Buck Regulator (PI352x family)
• Part number: PI3526-00-LGIZ
• Packaging: 10 × 14 LGA-SIP
• Typical applications: high-efficiency DC-DC buck regulation for wide-input voltage systems (telecom, datacom, computing, high-density power conversion)

Highlighted features

• Input ranges: 48 Vin (36–60 V) and 30–60 V variants
• Wide adjustable Vout: 2.2–14 V
• Peak efficiency >96% at 48 Vin
• High efficiency at light and full load; very-fast transient response
• HV ZVS-Buck topology for high efficiency
• Frequency synchronization
• User-adjustable soft-start and tracking
• Paralleling, single-wire current sharing and two-phase interleaving
• Constant voltage (CV) or constant current (CC) operation with internal CC error amplifier and reference
• Protections: OVLO/UVLO, OVP, OTP
• Internal compensation — minimal external components required

Key product data and commercialization info
Part Number: PI3526-00-LGIZ
Product family: ZVS Buck Regulator (PI352x family)
Input Voltage (illustrated): 48V
Output Voltage (illustrated): 12V (adjustable 2.2–14 V)
Maximum output current (Iout Max): 18 A
Package / Dimensions: 10 × 14 LGA-SIP — 14.0 × 10.0 × 2.56 mm
Temperature grades: LGIZ: -40°C; LGMZ: -55°C
Lead time: 28 weeks
Minimum order quantity: 1

Pricing (MSRP)
Quantity | MSRP (USD)
1+ | $25.26
10+ | $20.07
25+ | $18.31
100+ | $17.18

Available reference documents (titles only)

• Data Sheet: ds_PI352x-00.pdf (PDF)
• User Guide: ug_PI352x-0x_EvalBrd.pdf (PDF)
• White Paper: wp_PI33XX_ZVS.pdf (PDF)

Technical specifications

• Topology: HV ZVS-Buck (Zero-Voltage Switching Buck)
• Input voltage examples: 36–60 V and 30–60 V variants
• Output voltage: adjustable 2.2–14 V
• Peak efficiency: >96% at 48 Vin
• Paralleling and single-wire current sharing; two-phase interleaving
• Frequency synchronization supported
• User-adjustable soft-start and tracking
• Internal compensation: few external components required
• Protections: OVLO/UVLO, OVP, OTP
• Form factor: 10 × 10 × 2.6 mm and 10 × 14 × 2.6 mm LGA-SiP family platforms
• Typical mechanical footprint: 14.0 × 10.0 × 2.56 mm
• Typical applications: high-density power conversion, telecom/datacom, computing