COM Express computer-on-module COMe-cVR6 (E2)

AMD Ryzen™ Embedded V1605BAMD Ryzen™ Embedded R1505GAMD Ryzen™ Embedded V1202B

The COMe-cVR6 (E2) deliver a new generation of high-performance, feature-rich Computer-on-Modules based on the standardized COM Express® compact form factor and AMD’s Ryzen Embedded V/R-Series processors. Through the use of consistent COM Express connectors and feature implementation, the COMe-cVR6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards. Besides the high-performance graphics on a SOC level, the COMe-cVR6 offers the option to additionally or alternatively use soldered memory. As a result, the module supports a total of up to 48 GB RAM or provides more thermal and mechanical resistance with up to 16 GB memory down. Thanks to the fixed connection, soldered memory modules are better to cool and stay in reliable contact even when exposed to extreme vibrations or shocks. Therefore, customers can choose between more storage or greater ruggedness. Typical application areas can be found in markets such as professional gaming and entertainment as well as medical imaging and surveillance. In addition, the rugged E2 modules – together with memory down option, ECC memory support and industrial grade temp. range usage – meet the special requirements of applications for the Military/Defense and Transportation market.