Uniaxial accelerometer FUTURESES H201

piezoresistiveMEMSwith TEDS

Product overview
The FUTURESES H201 is a miniaturized uniaxial analog accelerometer designed for high-impact and shock measurements. Its lightweight construction minimizes mass loading on test structures while providing a wide dynamic range and high impact resistance suitable for crash and safety testing.

Key features

• Sensor technology: Piezoresistive (MEMS Wheatstone bridge)
• Number of sensitive directions: Uniaxial
• Output signal: Voltage
• Measurement ranges: 100 g, 500 g, 1000 g, 2000 g (±100 to ±2000 g)
• Frequency response: DC to 5000 Hz
• Impact resistance: up to 6,000 g
• Temperature range: -40°C to +120°C
• Protection class: IP67 (with epoxy potting)
• Options: varying cable lengths, connector options, Dallas DS2401 identification chip

Technology
These piezoresistive accelerometers are based on proven MEMS technology using a Wheatstone bridge of four variable resistors to deliver a stable voltage output. The H201 provides accurate measurements across a wide bandwidth and maintains performance under extreme shock conditions.

Housing and configuration
Epoxy potting provides IP67 protection. Multiple configuration options include integrated cable length choices, connector variants and optional Dallas DS2401 chip for identification. The compact, lightweight housing is optimized for integration into test structures where minimal mass is critical.

Applications
Intended for high-impact and shock measurement tasks such as automotive side and frontal impact tests, crash testing, safety validation and other environments requiring compact sensors with high shock tolerance.

Technical specifications

• Sensor type: Analog accelerometer
• Sensor technology: Piezoresistive (MEMS, Wheatstone bridge)
• Number of axes: Uniaxial
• Output: Voltage
• Measurement ranges: 100 g, 500 g, 1000 g, 2000 g (±100 to ±2000 g)
• Frequency response: DC to 5000 Hz
• Impact resistance: up to 6,000 g
• Temperature range: -40°C to +120°C
• Protection class: IP67 (with epoxy potting)
• Options: varying cable lengths, connector variants, Dallas DS2401 chip integration
• Design: miniaturized, lightweight for minimal mass loading