Pt100 temperature sensor P0K1.202.6W.B.007

RTDthin-filmplatinum resistive

Short description
Thin-film platinum Pt100 RTD P0K1.202.6W.B.007 for -200 °C to +600 °C. ESD-optimized resistor design and lead-free passivation for RoHS compliance. Intended for industrial high-temperature sensing where ESD robustness and interchangeability are required.

Product details
Platinum sensors from Innovative Sensor Technology (IST AG) are engineered for extreme temperature applications. Devices use thin-film platinum technology and are available in SMD and wired formats with dimensions adapted to assembly and process requirements. Standard compliance is to IEC 60751 with multiple tolerance classes and customization options for lead wires and packaging.

ESD optimized design
The resistor layout and manufacturing process are optimized for enhanced ESD resistance. Devices have been tested to IEC/EN 61000-4-2 and internal test capabilities are available to support design validation against international ESD standards.

Quality and compliance
IST AG production follows certified quality and environmental management systems (ISO 9001:2015, ISO 14001:2015). Lead-free cover and passivation glass are implemented for RoHS compliance while maintaining interchangeability and traceability.

Key features

• Product Name: P0K1.202.6W.B.007
• Nominal resistance: 100 Ω at 0 °C
• Operating temperature range: -200 °C to +600 °C
• TCR: Pt 3850 ppm/K
• Chip size/dimensions: 1.8 x 2.0 x 1.1 mm
• Tolerance/class: IEC 60751 F0.3 (IST AG class B)
• Connection type: Pt/Ni-wire, Ø 0.2 mm
• Wire length: 7 mm
• Special: ESD optimized design (IEC/EN 61000-4-2)
• Packaging: Blister
• Product Old code: replaces former 100871 and 153742
• Product code: 157130

Pricing (per piece)
Quantity (pieces) | Price (per piece)
10-49 | CHF 4.77
50-99 | CHF 3.78
100-150 | CHF 3.35

Technical specifications

• Type: Thin-film platinum RTD (Pt100)
• Nominal resistance at 0 °C: 100 Ω
• Temperature range: -200 °C to +600 °C
• TCR: 3850 ppm/K (Pt)
• Accuracy / tolerance: IEC 60751 F0.3 (IST AG class B)
• Chip dimensions: 1.8 x 2.0 x 1.1 mm
• Connection: Pt/Ni-wire Ø 0.2 mm
• Wire length: 7 mm
• Special characteristics: ESD optimized design (tested to IEC/EN 61000-4-2)
• Packaging: Blister
• Compliance note: Lead-free cover/passivation glass implementation for RoHS compliance