RTD temperature sensor P1K0.161.3FC.B.M

Pt1000platinum resistiveSMD

Overview
-50 °C to +200 °C, 1.6 x 1.2 mm chip, bondable Au-pads and metallized backside. Improved thermal conductivity for compact assemblies suitable for semiconductor and microelectronics, medical devices, aerospace & defense, industrial instrumentation, e-mobility and automotive applications.

Key features

• Platinum Pt1000 RTD sensing element, IEC 60751 F0.3 accuracy
• Bondable Au-pads for wire bonding or flip-chip assembly
• Metallized backside for enhanced thermal coupling
• Compact chip format for MEMS, MCM and hybrid circuits
• Customer-specific variants available on request

Applications

• Embedded temperature sensing in hybrid circuits or multi-chip modules
• Thermal management in high-density integrated circuits
• Lab-on-chip systems requiring high-precision thermal control for diagnostics
• Thermal monitoring in sensitive instrumentation or guidance systems
• Optical and die package integration, temperature control of LEDs or high-power ICs
• Battery management systems in electric vehicles
• Power electronics thermal monitoring

Price (per piece)
Quantity (pieces) | Price (per piece)
10-49 | CHF 14.94
50-99 | CHF 13.54
100-150 | CHF 12.62

Product details
Part number: P1K0.161.3FC.B.M. Product code: 100797. Chip package supplied in chip tray, sensor-side up. Platinum RTD optimized for compact integration and improved thermal coupling via metallized backside and bondable Au-pads. Part of the IST AG platinum sensor family offering a wide portfolio of sizes and accuracy classes.

Technical specifications

• Nominal resistance: 1000 Ω at 0 °C
• Operating temperature range: -50 °C to +200 °C
• TCR: Pt 3850 ppm/K
• Chip size: 1.6 x 1.2 x 0.25 mm
• Tolerance / class: IEC 60751 F0.3 (IST AG tolerance class B)
• Connection type: bondable Au-pads
• Special: bondable Au-pads, metallized backside
• Packaging: Chip tray, sensor-side up
• Availability: 100 pieces available in stock