RTD temperature sensor P0K1.0805.3FC.B
thin-filmPt100platinum resistive

RTD temperature sensor - P0K1.0805.3FC.B - Innovative Sensor Technology IST AG - thin-film / Pt100 / platinum resistive
RTD temperature sensor - P0K1.0805.3FC.B - Innovative Sensor Technology IST AG - thin-film / Pt100 / platinum resistive
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Characteristics

Technology
Pt100, RTD, platinum resistive, thin-film
Mounting
SMD, surface-mount
Temperature

Max.: 250 °C
(482 °F)

Min.: -50 °C
(-58 °F)

Description

Product summary
Pt100 FlipChip temperature sensor P0K1.0805.3FC.B (product code 102050) for SMD/FlipChip PCB assembly. Nominal resistance 100 Ω at 0 °C, operating range -50 °C to +250 °C, chip size 2.0 x 1.2 x 0.4 mm, bondable and solderable Au pads.

Key features
  • Nominal resistance: 100 Ω at 0 °C
  • Operating temperature range: -50 °C to +250 °C (FC 0805)
  • TCR: Pt 3850 ppm/K
  • Chip size / dimensions: 2.0 x 1.2 x 0.4 mm
  • Tolerance / class: IEC 60751 F0.3 (IST AG tolerance class B)
  • Connection type: Bondable and solderable pads (Au)
  • Product name/code shown on page: P0K1.0805.3FC.B
  • Product code: 102050


Platinum Sensors
IST AG platinum RTD sensors cover a wide range of industrial temperature applications and are manufactured with materials suitable for extended operating ranges. Standard IEC 60751 sensors are available in classes F0.3, F0.15 and F0.1; higher accuracies can be supplied on request. Sensors can be delivered as SMD (wireless) or wired solutions in multiple sizes and configurations.

SMD and FlipChip
  • SMD: Platinum SMD RTDs for automatic PCB assembly with wrap-around contacts or solderable terminations. Available technologies include SAC305-tinned, high-temperature solder up to +250 °C, and Ni/Au for wire bonding. Accuracies up to IEC 60751 F0.15 and multiple package sizes (0805/1206) on request.
  • FlipChip: FlipChip RTDs feature contacts on one side to reduce backside short-circuit risk. Variants support reflow-soldering, bonding or welding processes. Available accuracies up to IEC 60751 F0.3 and sizes (0603/0805/1206); ideal for space-constrained PCB applications.


Small dimensions
Solutions for limited-space applications include MiniSens (1.2 mm x 1.6 mm) up to IEC 60751 F0.1 and operation to +600 °C, and SlimSens (0.8 mm x 3 mm) optimized for small-diameter tubes. MiniSens can be supplied with a metallized backside for improved thermal coupling.

Quality
IST AG is certified to ISO 9001:2015 and ISO 14001:2015. Manufacturing and quality processes are regularly audited and maintained.

Temperature measurement up to 600 °C in class A (PW)
The PW RTD sensor provides an alternative to wire-wound sensors with high accuracy and the benefits of thin-film technology: compact dimensions, low hysteresis and robustness. The PW sensor achieves IEC 60751 F0.15 across an extended range (-200 °C to +600 °C) and is available in housings compatible with standard wire-wound sensors.

ESD optimized design
ESD-optimized sensors are available and tested according to IEC/EN 61000-4-2; in-house ESD laboratory testing can be provided.

Pricing and availability
2000 pieces available in stock.

Pricing (per piece)
  • 100-250 | CHF 3.40
  • 251-500 | CHF 2.16
  • 501-2500 | CHF 1.96


Technical specifications
  • Model / denomination: Pt100 FlipChip class F0.3
  • Product Name (internal): P0K1.0805.3FC.B
  • Product code: 102050
  • Nominal resistance: 100 Ω at 0 °C
  • Operating temperature range: -50 °C to +250 °C
  • TCR: Pt 3850 ppm/K
  • Chip size / dimensions: 2.0 x 1.2 x 0.4 mm
  • Tolerance / class: IEC 60751 F0.3 (IST AG tolerance class B)
  • Connection type: Bondable and solderable pads (Au)
  • Packaging / availability: 2000 pieces in stock
  • Typical applications: SMD/FlipChip PCB assembly, space-constrained temperature sensing, automated assembly processes

Catalogs

No catalogs are available for this product.

See all of Innovative Sensor Technology IST AG‘s catalogs

Exhibitions

Meet this supplier at the following exhibition(s):

electronica Munich 2026
electronica Munich 2026

10-13 Nov 2026 Munich (Germany) Stand 229

  • More information
    COMPAMED 2026
    COMPAMED 2026

    16-19 Nov 2026 Düsseldorf (Germany) Hall 8a - Stand H29-1

  • More information

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