RTD temperature sensor P0K1.0805.3FC.A.S

Pt100platinum resistivesurface-mount

Product overview
FC (FlipChip) platinum RTD temperature sensor, nominal 100 Ω at 0 °C, operating range -50 °C to +250 °C. FC 0805 package, taped only (without reel), sensor side down for automated assembly.

Product identifiers

• Product name / internal reference: P0K1.0805.3FC.A.S
• Product code: 155650

Key features

• Nominal resistance: 100 Ω at 0 °C
• Operating temperature range: -50 °C to +250 °C
• TCR: Pt 3850 ppm/K
• Chip dimensions: 2.0 x 1.25 x 0.50 mm (0805)
• Tolerance / class: IEC 60751 F0.15 (IST AG reference class A)
• Connection type: Bondable and solderable gold-plated pads
• Packaging: Taped only, sensor side down (without reel)

Pricing (per piece)
Quantity (pieces) | Price (per piece)
25-49 | CHF 3.40
50-99 | CHF 2.16
100-150 | CHF 1.96

Platinum Sensors
Innovative Sensor Technology IST AG platinum RTD sensors are designed for wide temperature ranges and demanding applications. Standard IEC 60751 sensors are available in classes F0.3, F0.15 and F0.1, with higher accuracies on request. Sensors are offered in SMD (wireless) and wired configurations, in sizes from 0.75 mm to 10 mm (length) and 0.75 mm to 5.08 mm (width). Customization of lead wires, insulation and configurations is available.

SMD and FlipChip

• SMD – Wireless SMD platinum RTD sensors for automatic PCB assembly with wrap-around contacts on both ends. Available technologies include SAC305 tinned wrap-around, high-temperature solder wrap-around for up to +250 °C, and Ni/Au contacts for wire bonding. SMD sensors offer excellent long-term stability, fast response and low self-heating, with accuracies up to IEC 60751 F0.15.
• FlipChip – FlipChip sensors provide platinum RTD elements with contacts on one side to avoid backside short-circuits. Variants support reflow soldering, bonding or welding processes. Available accuracies up to IEC 60751 F0.3 (IST reference class B) and common sizes 0603/0805/1206; other sizes on request. FlipChips are optimized for limited-space applications and offer a favorable price/performance ratio.

Small dimensions
IST AG offers MiniSens and SlimSens families for very limited-space applications. MiniSens provides minimal footprint options (e.g. 1.2 x 1.6 mm) with accuracies up to IEC 60751 F0.1 and operation up to +600 °C; options include metallized backside for improved thermal coupling. SlimSens (e.g. 0.8 x 3 mm) is designed for insertion into small-diameter tubes and is available with high-accuracy options and long welded leads for use up to +600 °C.

Quality
IST AG is certified to ISO 9001:2015 (quality) and ISO 14001:2015 (environment). Processes are audited regularly to ensure product reliability.

Technical specifications

• Commercial denomination: FlipChip Pt 100 0805 3FC
• Product name / internal reference: P0K1.0805.3FC.A.S
• Product code: 155650
• Nominal resistance: 100 Ω at 0 °C
• Operating temperature range: -50 °C to +250 °C
• TCR: Pt 3850 ppm/K
• Chip size/dimensions: 2.0 x 1.25 x 0.50 mm
• Tolerance / class: IEC 60751 F0.15 (IST AG reference class A)
• Connection type: Bondable and solderable gold-plated pads
• Packaging: Taped only, sensor side down (without reel)