RTD temperature sensor P1K0.0707.3FC.B.T.S

Pt1000platinum resistiveSMD

Product overview
Bondable platinum 1000 Ω RTD component designed for automatic placement on printed circuit boards. Typical applications include energy management (thermal compensation), industrial and medical devices. Very small size with bondable Au pads and packaging options for chip tray (sensor-side up) or taped reel.

BondSens (0.75 x 0.75 mm)
iST’s smallest platinum temperature sensor operates within a temperature range of -50 °C to +150 °C (according to DIN EN 60751). Designed for automatic high-volume placement on PCBs where long-term stability, interchangeability and low cost are important. Features very low drift, can be integrated within semiconductor devices and is designed for Au-wire bonding. Customized adaptations are available on request.

Platinum Sensors
iST AG platinum temperature sensors are produced with high-quality materials and provide solutions for extreme temperature applications (range -200 °C to +1000 °C for some products). Standard IEC 60751 sensors are offered in class F0.3, F0.15, F0.1 and higher accuracies upon request. Sensors are available in wireless (SMD) and wired configurations and in various sizes; standard sensors can be customized for lead wire material, insulation, length and configurations.

Small dimensions

• MiniSens: smallest footprint (1.2 mm x 1.6 mm), accuracies up to IEC 60751 F0.1, long directly welded wires, operation up to +600 °C, optional metallized backside for optimal thermal coupling.
• SlimSens: 0.8 mm x 3 mm for tube applications (from 1 mm diameter), accuracies up to IEC 60751 F0.1, long directly welded wires, operation up to +600 °C.

SMD and FlipChip

• SMD: wireless RTD Platinum SMD sensors for automatic PCB assembly with wrap-around contacts; available with SAC305-tinned contacts, high-temperature solder wrap-around contacts (up to +250 °C) or Ni/Au wrap-around for bonding/wire-bonding; available in standard dimensions (0805/1206) and accuracies up to IEC 60751 F0.15.
• FlipChip: wireless FlipChip series with contacts on one side (no backside short-cut risk), available for reflow-soldering, bonding or welding processes; available in dimensions such as 0603/0805/1206 and accuracies up to IEC 60751 F0.3.

Quality
iST AG quality management: certified to ISO 9001:2015 (quality) and ISO 14001:2015 (environment). Appropriate audited processes ensure consistent product quality.

Technical specifications

• Product Name: P1K0.0707.3FC.B.T.S
• Commercial designation (model): BondSens Pt1000 class F0.3
• Nominal resistance: 1000 Ω at 0 °C
• Operating temperature range: -50 °C to +150 °C
• TCR: Pt 3850 ppm/K
• Chip size / dimensions: 0.75 x 0.75 x 0.3 mm
• Tolerance / class: IEC 60751 F0.3 (IST AG tolerance class B)
• Connection type: Bondable pads (Au)
• Packaging: Chip tray, sensor-side up (also available taped on reel as variant)
• Product code: 104316