MOSFET for automotive applications SCT4065DTWHR

SiCsilicon carbidehigh-speed

Overview
The SCT4065DTWHR is a SiC MOSFET in the TSC3PAK surface-mount package designed for high-voltage power conversion. The package uses a top-side heat dissipation structure that places the heat-sink surface on the package top, enabling automated board mounting while delivering thermal performance comparable to through-hole packages. ROHM's proprietary groove design secures a creepage distance of 6.66 mm, supporting AC peak voltages up to 1200 V in Pollution Degree 2 environments. The device features low ON resistance and fast switching to reduce switching losses and improve converter efficiency and reliability, making it suitable for automotive and industrial high-voltage applications.

Key Features

• AEC-Q101 qualified (automotive grade)
• Wide creepage distance: min. 6.66 mm (supports 1200 V AC peak in Pollution Degree 2)
• Low drain-source ON-resistance (RDS(on) typ. 65 mΩ)
• Fast switching and reduced switching losses
• Fast reverse recovery
• Easy paralleling for higher current capacity
• Simple gate drive requirements
• Pb-free lead plating; RoHS compliant

Package & Mechanical Highlights

• TSC3PAK surface-mount package with top-side heat dissipation provides thermal performance comparable to through-hole packages while allowing automated assembly
• ROHM groove structure secures creepage distance (6.66 mm) for improved insulation design in high-voltage systems
• Package dimensions optimized for high thermal performance and space-saving surface-mount layouts (14.0 × 18.58 mm, t ≈ 3.625 mm)

Applications

• Automotive: onboard chargers (OBC), electric compressors
• PV inverters and renewable energy converters
• High-performance server and telecom power supplies

Technical specifications

• Part Number: SCT4065DTWHRTCR
• Model: SCT4065DTWHR
• Brand: ROHM
• Drain-Source Voltage (Vds): 750 V
• Drain-Source On-state Resistance (Typ.): 65 mΩ
• Generation: 4th Gen (Trench)
• Drain Current (Id): 24 A
• Total Power Dissipation: 81 W
• Junction Temperature (Max.): 175 °C
• Storage Temperature Range: -40 to 175 °C
• Package: TSC3PAK (surface-mount with top-side heat-sink)
• Package Size: 14.0 x 18.58 mm (t = 3.625 mm)
• Packing Type: Taping
• Unit Quantity: 600 (minimum package quantity: 600)
• RoHS: Yes
• MSL: 1