Point of use (POU) temperature control systems can reduce energy consumption by up to 90 % compared to compressor-based systems. Minimal space requirements with the option of underfloor installation at the point of use minimizes cleanroom use. Quick and precise temperature control of the process temperature profiles to ±0.1 °C improves wafer-to-wafer homogeneity.
Features
Thermoelectric process thermostat with low energy consumption
Quiet and low vibration level operation due to refrigerant free cooling technology
No filters or DI components required
With a connection to purge with clean dry air (CDA) to prevent condensation
Use of perfuorinated fluids
Water cooled system
Compact overall size and low weight
Extremely low volume of heat transfer liquid
SEMI S2 and F47 compliant
Technical data (according to DIN 12876)
Temperature stability
0.1 ± K
Heater power min.
3 kW
Min. filling volume
1 L
Max. filling volume
1.3 L
Dimensions (WxDxH)
116 x 232 x 470 mm
Weight
15 kg
Power supply
Connection to PSC