Metallographic sample grinding polishing machine MoPao® 3S

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Overview
The MoPao® 3S automatic grinding and polishing machine is a dual-disc benchtop system designed to standard industrial requirements. It provides fully automated metallographic sample preparation from coarse grinding to fine polishing, using microprocessor control with stepless speed adjustment for platens and head, and intuitive settings for load and time. Operators change grinding/polishing platens, abrasive papers or polishing cloths to perform each stage, enabling flexible workflows for industrial labs, R&D and university facilities.

Features

• Microprocessor control with stepless speed regulation for platen and head.
• Platen speed stepless from 50–1000 r/min; preset fixed speeds: 150 / 300 / 600 / 1000 r/min.
• Head speed stepless regulation: 50–150 r/min.
• Selectable platen rotation direction (clockwise or counterclockwise).
• Quick-change platen mounting for fast tool swaps.
• Multi-sample holder with pneumatic single-point loading (standard 6-sample capacity).
• Optional automatic abrasive dispensing (liquid dispenser available).
• Water-cooling and abrasive-flushing nozzles to prevent overheating and remove debris.
• ABS housing and stainless-steel standard parts; cast-aluminium base for rigidity and low noise.

Key Technical Specifications
Disc diameter: φ250 mm (optional φ203 mm)
Platen speed: 50–1000 r/min (20 rpm increments); fixed: 150 / 300 / 600 / 1000 r/min
Platen rotation: clockwise / counterclockwise adjustable
Head speed: 50–150 r/min (stepless)
Load range: 5–60 N
Samples per run: 6 (standard)
Sample time: 0–995 s
Specimen diameter: Φ30 mm (standard); optional Φ22 / Φ25 / Φ30 / Φ40 mm
Compressed air: 0.6–0.9 MPa
Power supply: 1.1 kW, Single-phase AC 220V 50Hz
Dimensions (L×W×H): 760 × 706 × 736 mm
Net weight: 128 kg
Gross weight: 152 kg

Details of Consumable Gifts
1 | Adhesive-backed metallographic sandpaper | piece | 20 | 240#
2 | Adhesive-backed metallographic sandpaper | piece | 20 | 400#
3 | Adhesive-backed metallographic sandpaper | piece | 20 | 800#
4 | Adhesive-backed metallographic sandpaper | piece | 20 | 1200#
5 | Silk velvet with adhesive backing | piece | 3 | —
6 | Wool fabric with adhesive | piece | 3 | —
7 | Magnetic rubber pad | piece | 2 | —
8 | Non-stick tray | piece | 5 | —
9 | Diamond suspension grinding and polishing fluid | bottle | 1 | W2.5 500 ml
10 | Diamond spray polishing agent | bottle | 1 | W2.5 350 ml

Technical specifications

• Model: MoPao® 3S
• Dual-disc benchtop design for full coarse→fine grinding and polishing workflow
• Disc diameter: φ250 mm (φ203 mm optional)
• Platen speed range: 50–1000 r/min (20 rpm increments)
• Head speed: 50–150 r/min (stepless)
• Load range: 5–60 N
• Samples per run: 6 (standard)
• Supported specimen diameters: Φ22 / Φ25 / Φ30 / Φ40 mm (Φ30 mm standard)
• Power: 1.1 kW; Voltage: Single-phase AC 220V 50Hz
• Compressed air: 0.6–0.9 MPa
• Dimensions: 760×706×736 mm; Net weight: 128 kg